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AM29LV640MU120PCI Fiches technique(PDF) 4 Page - Advanced Micro Devices |
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AM29LV640MU120PCI Fiches technique(HTML) 4 Page - Advanced Micro Devices |
4 / 54 page 4 Am29LV640MU April 26, 2002 ADV AN CE I N F O RM AT I O N TABLE OF CONTENTS MirrorBit 64 Mbit Device Family . . . . . . . . . . . . . . 3 Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 5 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 6 Special Package Handling Instructions .................................... 7 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 9 Device Bus Operations . . . . . . . . . . . . . . . . . . . . 10 Table 1. Device Bus Operations .....................................................10 VersatileIO (V IO) Control ..................................................... 10 Requirements for Reading Array Data ................................... 10 Page Mode Read .................................................................... 11 Writing Commands/Command Sequences ............................ 11 Write Buffer ............................................................................. 11 Accelerated Program Operation ............................................. 11 Autoselect Functions .............................................................. 11 Standby Mode ........................................................................ 11 Automatic Sleep Mode ........................................................... 11 RESET#: Hardware Reset Pin ............................................... 12 Output Disable Mode .............................................................. 12 Table 2. Sector Address Table ........................................................13 Autoselect Mode..................................................................... 15 Table 3. Autoselect Codes, (High Voltage Method) .......................15 Sector Group Protection and Unprotection ............................. 16 Table 4. Sector Group Protection/Unprotection Address Table .....16 Temporary Sector Group Unprotect ....................................... 17 Figure 1. Temporary Sector Group Unprotect Operation................ 17 Figure 2. In-System Sector Group Protect/Unprotect Algorithms ... 18 SecSi (Secured Silicon) Sector Flash Memory Region .......... 19 Table 5. SecSi Sector Contents ......................................................19 Hardware Data Protection ...................................................... 19 Low VCC Write Inhibit ............................................................ 19 Write Pulse “Glitch” Protection ............................................... 20 Logical Inhibit .......................................................................... 20 Power-Up Write Inhibit ............................................................ 20 Common Flash Memory Interface (CFI) . . . . . . . 20 Table 6. CFI Query Identification String .............................. 20 Table 7. System Interface String......................................................21 Table 8. Device Geometry Definition................................... 21 Table 9. Primary Vendor-Specific Extended Query............. 22 Command Definitions . . . . . . . . . . . . . . . . . . . . . 22 Reading Array Data ................................................................ 22 Reset Command ..................................................................... 23 Autoselect Command Sequence ............................................ 23 Enter SecSi Sector/Exit SecSi Sector Command Sequence .. 23 Word Program Command Sequence ..................................... 23 Unlock Bypass Command Sequence ..................................... 24 Write Buffer Programming ...................................................... 24 Accelerated Program .............................................................. 25 Figure 3. Write Buffer Programming Operation............................... 26 Figure 4. Program Operation .......................................................... 27 Program Suspend/Program Resume Command Sequence ... 27 Figure 5. Program Suspend/Program Resume............................... 28 Chip Erase Command Sequence ........................................... 28 Sector Erase Command Sequence ........................................ 28 Erase Suspend/Erase Resume Commands ........................... 29 Figure 6. Erase Operation.............................................................. 30 Command Definitions ............................................................. 31 Table 10. Command Definitions...................................................... 31 Write Operation Status . . . . . . . . . . . . . . . . . . . . . 32 DQ7: Data# Polling ................................................................. 32 Figure 7. Data# Polling Algorithm .................................................. 32 RY/BY#: Ready/Busy#............................................................ 33 DQ6: Toggle Bit I .................................................................... 33 Figure 8. Toggle Bit Algorithm........................................................ 34 DQ2: Toggle Bit II ................................................................... 34 Reading Toggle Bits DQ6/DQ2 ............................................... 34 DQ5: Exceeded Timing Limits ................................................ 35 DQ3: Sector Erase Timer ....................................................... 35 DQ1: Write-to-Buffer Abort ..................................................... 35 Table 11. Write Operation Status ................................................... 35 Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 36 Figure 9. Maximum Negative Overshoot Waveform ..................... 36 Figure 10. Maximum Positive Overshoot Waveform..................... 36 Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 36 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 37 Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Figure 11. Test Setup.................................................................... 38 Table 12. Test Specifications ......................................................... 38 Key to Switching Waveforms. . . . . . . . . . . . . . . . 38 Figure 12. Input Waveforms and Measurement Levels...................................................................... 38 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 39 Read-Only Operations ........................................................... 39 Figure 13. Read Operation Timings ............................................... 39 Figure 14. Page Read Timings ...................................................... 40 Hardware Reset (RESET#) .................................................... 41 Figure 15. Reset Timings ............................................................... 41 Erase and Program Operations .............................................. 42 Figure 16. Program Operation Timings.......................................... 43 Figure 17. Accelerated Program Timing Diagram.......................... 43 Figure 18. Chip/Sector Erase Operation Timings .......................... 44 Figure 19. Data# Polling Timings (During Embedded Algorithms)...................................................... 45 Figure 20. Toggle Bit Timings (During Embedded Algorithms)...................................................... 46 Figure 21. DQ2 vs. DQ6................................................................. 46 Temporary Sector Unprotect .................................................. 47 Figure 22. Temporary Sector Group Unprotect Timing Diagram ... 47 Figure 23. Sector Group Protect and Unprotect Timing Diagram .. 48 Alternate CE# Controlled Erase and Program Operations ..... 49 Figure 24. Alternate CE# Controlled Write (Erase/Program) Operation Timings.......................................................................... 50 Erase And Programming Performance. . . . . . . . 51 Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 51 TSOP Pin Capacitance . . . . . . . . . . . . . . . . . . . . . 51 Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 52 LAA064—64-Ball Fortified Ball Grid Array (FBGA) 13 x 11 mm Package .............................................................. 52 FBE063—63-Ball Fine-Pitch Ball Grid Array (FBGA) 12 x 11 mm Package .............................................................. 53 Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 54 |
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