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FMA3009 Fiches technique(PDF) 10 Page - Filtronic Compound Semiconductors

No de pièce FMA3009
Description  2-20GHZ BROADBAND MMIC AMPLIFIER
Download  10 Pages
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Fabricant  FILTRONIC [Filtronic Compound Semiconductors]
Site Internet  http://www.filtronic.co.uk/
Logo FILTRONIC - Filtronic Compound Semiconductors

FMA3009 Fiches technique(HTML) 10 Page - Filtronic Compound Semiconductors

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Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Tel: +44 (0) 1325 301111
Fax: +44 (0) 1325 306177
Email: sales@filcs.com
Website: www.filtronic.com
10
Pilot Datasheet v2.5
FMA3009
PREFERRED ASSEMBLY INSTRUCTIONS:
GaAs devices are fragile and should be
handled with great care. Specially designed
collets should be used where possible.
The
recommended
die
attach
is
gold/tin
eutectic solder under a nitrogen atmosphere.
Stage
temperature
should
be
280-290
°C;
maximum time at temperature is one minute.
The
recommended
wire
bond
method
is
thermo-compression wedge bonding with 0.7
or 1.0 mil (0.018 or 0.025 mm) gold wire.
Stage temperature should be 250-260
°C.
Bonds should be made from the die first and
then to the mounting substrate or package.
The physical length of the bondwires should be
minimised especially when making RF or
ground connections.
HANDLING
PRECAUTIONS:
To avoid damage to the devices care should
be
exercised
during
handling.
Proper
Electrostatic
Discharge
(ESD)
precautions
should be observed at all stages of storage,
handling,
assembly,
and
testing.
These
devices should be treated as Class 0 (0-250 V)
as defined in JEDEC Standard No. 22-A114.
Further information on ESD control measures
can be found in MIL-STD-1686 and MIL-
HDBK-263.
APPLICATION NOTES & DESIGN DATA:
Application Notes and design data including S-
parameters available on request.
DISCLAIMERS:
This product is not designed for use in any
space
based
or
life
sustaining/supporting
equipment.
ORDERING INFORMATION:
PART NUMBER
DESCRIPTION
FMA3009
Die in Waffle-pack
(Gel-pak available on request)


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