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ST14C02C Fiches technique(PDF) 1 Page - STMicroelectronics |
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ST14C02C Fiches technique(HTML) 1 Page - STMicroelectronics |
1 / 13 page 1/13 December 1999 D10, D15, D20, D22, C20, C30 MICROMODULES Memory Micromodules General Information for D1, D2 and C Packaging s Micromodules were developed specifically for embedding in Smartcards and Memory Cards s The Micromodule provides: – Support for the chip – Electrical contacts – Suitable embedding interface for gluing the module to the plastic package s Physical dimensions and contact positions compliant to the ISO 7816 standard s Micromodules delivered as a continuous Super 35 mm tape. (This differs from the standard 35 mm tape in the spacing distance between the indexing holes.) DESCRIPTION Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip). The plastic card is made of PVC, ABS or similar material, and can be over-printed with graphics, text, and magnetic strips. The Micromodule is embedded in a cavity in the plastic card. The Micromodules are mounted on Super 35 mm metallized epoxy tape, and are delivered on reels. These contain all of the chips from a number of wafers, including those chips that were found to be non-functioning during testing. Traceability is ensured by a label fixed on the reel. D10 D20 potting side contact side D15 D22 C30 C20 Table 1. Memory Card and Memory Tag Integrated Circuits Modul e Please see the data briefing sheets of these products for example illustrations of these micromodules D10 ST1200, ST1305B, ST1331, ST1333, ST1335, ST1336, ST1353, ST1355 D15 ST14C02, ST1305B, ST1335, ST1336, ST1355 D20 ST14C02, M14C04, M14C16, M14C32 D22 M14C64, M14128, M14256 C30 M35101, M35102 C20 M35101, M35102 |
Numéro de pièce similaire - ST14C02C |
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Description similaire - ST14C02C |
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