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BAR43SFILM Fiches technique(PDF) 3 Page - STMicroelectronics |
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BAR43SFILM Fiches technique(HTML) 3 Page - STMicroelectronics |
3 / 5 page BAR42FILM / BAR43FILM 3/5 Figure 3: Reverse leakage current versus reverse voltage applied (typical values) Figure 4: Reverse leakage current versus junction temperature Figure 5: Junction capacitance versus reverse voltage applied (typical values) Figure 6: Relative variation of thermal impedance junction to ambient versus pulse duration (epoxy FR4 with recommended pad layout, e(Cu)=35µm) Figure 7: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35µm) 0 5 10 15 20 25 30 1E-2 1E-1 1E+0 1E+1 1E+2 I (µA) R V (V) R T =100°C j T =50°C j T =25°C j 0 25 50 75 100 125 150 1E-2 1E-1 1E+0 1E+1 1E+2 1E+3 1E+4 I (µA) R V (V) R V =30V R 12 5 10 20 30 1 2 5 10 C(pF) V (V) R F=1MHz T =25°C j 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 0.01 0.10 1.00 Z/R th(j-a) th(j-a) T δ=tp/T tp t (s) p δ = 0.5 δ = 0.2 δ = 0.1 Single pulse 0 5 10 15 20 25 30 35 40 45 50 150 200 250 300 350 R (°C/W) th(j-a) S(CU)(mm²) P=0.25W |
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