www.ti.com

TG

C

C

TG

C

C

TG

C

C

C

TG

C

C

CLR

CLK

D

PRE

Q

Q

C

6

2

7

3

5

1

SN74AUC1G74

SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP

WITH CLEAR AND PRESET

SCES537D – DECEMBER 2003 – REVISED JUNE 2007

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoFree™ – WCSP (DSBGA)

Reel of 3000

SN74AUC1G74YZPR

0.23-mm Large Bump – YZP (Pb-free)

_ _ _UP_

NanoFree™ – WCSP (DSBGA)

Reel of 3000

SN74AUC1G74YZTR

0.23-mm Large Bump – YZT (Pb-free)

–40

°C to 85°C

QFN – RSE

Reel of 3000

SN74AUC1G74RSER

UP

SSOP – DCT

Reel of 3000

SN74AUC1G74DCTR

U74_ _ _

VSSOP – DCU

Reel of 3000

SN74AUC1G74DCUR

U74_

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(3)

DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.

DCU: The actual top-side marking has one additional character that designates the assembly/test site.

YZP/YZT: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

• = Pb-free).

FUNCTION TABLE

INPUTS

OUTPUTS

PRE

CLR

CLK

D

Q

Q

L

H

X

X

H

L

X

L

X

X

L

H

H

H

↑

H

H

L

H

H

↑

L

L

H

H

H

L

X

LOGIC DIAGRAM (POSITIVE LOGIC)

A.

Pin numbers shown are for the DCT, DCU, YZP, and YZT packages only.

2

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