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TLP597GA Fiches technique(PDF) 2 Page - Toshiba Semiconductor

No de pièce TLP597GA
Description  Photo Relay
Download  6 Pages
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Fabricant  TOSHIBA [Toshiba Semiconductor]
Site Internet  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TLP597GA Fiches technique(HTML) 2 Page - Toshiba Semiconductor

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TLP597GA
2007-10-01
2
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Forward current
IF
50
mA
Forward current derating (Ta ≥ 25°C)
ΔIF/°C
−0.5
mA/°C
Peak forward current
(100 μs pulse, 100 pps)
IFP
1
A
Reverse voltage
VR
5
V
LED
Junction temperature
Tj
125
°C
Off-state output terminal voltage
VOFF
400
V
A connection
120
B connection
120
On-state current
C connection
ION
240
mA
A connection
−1.2
B connection
−1.2
On-state current derating
(Ta ≥ 25°C)
C connection
ΔION/°C
−2.4
mA/°C
Detector
Junction temperature
Tj
125
°C
Storage temperature range
Topr
−55 to 125
°C
Operating temperature range
Tstg
−40 to 85
°C
Lead soldering temperature (10 s)
Tsol
260
°C
Isolation voltage (AC, 1 min, R.H. ≤ 60%)
(Note 1)
BVS
2500
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Device considered a two-terminal device : Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6 are
shorted together.
Recommended Operating Conditions
Characteristics
Symbol
Min
Typ.
Max
Unit
Supply voltage
VDD
320
V
Forward current
IF
5
7.5
25
mA
On-state current
ION
120
mA
Operating temperature
Topr
−20
65
°C
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
Circuit Connections
A Connection
B Connection
C Connection
1
2
5
6
3
4
LOAD
AC
or
DC
1
25
6
34
LOAD
DC
1
25
6
34
LOAD
DC


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