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MCZ33927EK Fiches technique(PDF) 6 Page - Freescale Semiconductor, Inc |
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MCZ33927EK Fiches technique(HTML) 6 Page - Freescale Semiconductor, Inc |
6 / 44 page Analog Integrated Circuit Device Data 6 Freescale Semiconductor 33927 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings Symbol Value Unit ELECTRICAL RATINGS VBAT Supply Voltage Normal Operation (Steady-State) Transient Survival(1) VBAT 58 -1.5 to 80 V VPWR Supply Voltage Normal Operation (Steady-State) Transient Survival(1) VPWR 58 -1.5 to 80 V Charge Pump (PUMP, VPUMP) VPUMP -0.3 to 40 V VLS Regulator Outputs (VLS, VLS_CAP) VLS -0.3 to 18 V Logic Supply Voltage VDD -0.3 to 7.0 V Logic Output (INT, SO, PHASEA, PHASEB, PHASEC, OC_OUT)(2) VOUT -0.3 to 7.0 V Logic Input Pin Voltage (EN1, EN2, Px_HS, Px_LS, SI, SCLK, CS, RST) 10mA VIN -0.3 to 7.0 V Amplifier Input Voltage (Both Inputs-GND), (AMP_P - GND) or (AMP_N - GND) 6mA source or sink VIN_A -7.0 to 10.0 V Over-current comparator threshold 10mA VOC -0.3 to 7.0 V Driver Output Voltage(3) High-Side bootstrap (PA_BOOT, PB_BOOT, PC_BOOT) High-Side (PA_HS_G, PB_HS_G, PC_HS_G) Low-Side (PA_LS_G, PB_LS_G, PC_LS_G) VBOOT VHS_G VLS_G 75 75 16 V Driver Voltage Transient Survival High-Side (PA_HS_G, PB_HS_G, PC_HS_G, PA_HS_S, PB_HS_S, PC_HS_S) Low-Side (PA_LS_G, PB_LS_G, PC_LS_G, PGNDA, PGNDB, PGNDC) VHS_G VHS_S VLS_G VPGND -7.0 -7.0 -7.0 -7.0 V Continuous Output Current IGATE -0.1 to 0.1 A ESD Voltage(4) Human Body Model - HBM (All pins except for the pins listed below) Pins: PA_Boot, PA_HS_S, PA_HS_G, PB_Boot, PB_HS_S, PB_HS_G, PC_Boot, PC_HS_S, PC_HS_G, VPWR Charge Device Model - CDM VESD ±2000 ±1000 ±750 V Notes 1. The device will withstand load dump transient as defined by ISO7637 with peak voltage of 80V. 2. Short-circuit proof, the device will not be damaged or induce unexpected behavior due to shorts to external sources within this range. 3. This voltage should not be applied without also taking voltage at HS_S and voltage at PGND_x into account. 4. ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100pF, RZAP = 1500Ω) and the Charge Device Model (CDM), Robotic (CZAP = 4.0pF). |
Numéro de pièce similaire - MCZ33927EK |
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Description similaire - MCZ33927EK |
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