CXG1194XR datasheet(6/6 Pages) SONY

No de pièce	CXG1194XR

Description	SP4T Antenna Switch for GSM/UMTS

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Fabricant	SONY [Sony Corporation]

Site Internet	http://www.sony.co.jp

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6 / 6 page

CXG1194XR

- 6 -

Sony Corporation

Package Outline

(Unit: mm)

SONY CODE

EIAJ CODE

JEDEC CODE

XQFN-14P-01

14PIN XQFN (PLASTIC)

TERMINAL SECTION

Note:Cutting burr of lead are 0.05mm MAX.

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

EPOXY RESIN

SOLDER PLATING

COPPER ALLOY

PACKAGE STRUCTURE

PACKAGE MASS

C

S

3

AB

C

S A-B

M

S

PIN 1 INDEX

10

11

14

1

4

7

8

0.35 ± 0.05

0.4 ± 0.1

8-C0.1

0.24

0.5

0.05

0.24

+0.09

-0.03

Solder Plating

0.01g

2.5

C

A-B

S

x4

0.05

LEAD PLATING SPECIFICATIONS

ITEM

LEAD MATERIAL

COPPER ALLOY

SOLDER COMPOSITION

Sn-Bi Bi:1-4wt%

PLATING THICKNESS

5-18µm

SPEC.

Numéro de pièce similaire - CXG1194XR

Fabricant	No de pièce	Fiches technique	Description
Sony Corporation	CXG1194UR	54Kb / 6P	SP4T Antenna Switch for GSM

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Description similaire - CXG1194XR

Fabricant	No de pièce	Fiches technique	Description
Sony Corporation	CXG1224XR	100Kb / 7P	SP4TSP4T Antenna Switch for GSM/UMTS
	CXG1194UR	54Kb / 6P	SP4T Antenna Switch for GSM
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	CXG1068N	93Kb / 6P	SP4T Antenna Switch for GSM Dual band
	CXM3529XR	203Kb / 10P	SP9T Antenna Switch for GSM/UMTS Dual Mode
	CXG1198AEQ	143Kb / 11P	SP8T GSM/UMTS Dual Mode Antenna Switch
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	CXM3539XR	253Kb / 12P	SP8T Antenna Switch for GSM/UMTS Dual Mode Handsets

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CXG1194XR Fiches technique(PDF) 6 Page - Sony Corporation

CXG1194XR Fiches technique(HTML) 6 Page - Sony Corporation

Numéro de pièce similaire - CXG1194XR

Description similaire - CXG1194XR

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