JULY 2000 - REVISED FEBRUARY 2005

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

This small-outline package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will

withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high

humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly.

D008 Plastic Small-outline Package

TISP7015 (VLV) Overvoltage Protector

MECHANICAL DATA

NOTES: A. Leads are within 0.25 (0.010) radius of true position at maximum material condition.

B. Body dimensions do not include mold flash or protrusion.

C. Mold flash or protrusion shall not exceed 0.15 (0.006).

D. Lead tips to be planar within ±0.051 (0.002).

D008

8

765

4

3

2

1

8-pin Small Outline Microelectronic Standard

Package MS-012, JEDEC Publication 95

MDXXAA E

INDEX

4.80 - 5.00

(0.189 - 0.197)

5.80 - 6.20

(0.228 - 0.244)

3.81 - 4.00

(0.150 - 0.157)

1.35 - 1.75

(0.053 - 0.069)

0.102 - 0.203

(0.004 - 0.008)

0.28 - 0.79

(0.011 - 0.031)

0.51 - 1.12

(0.020 - 0.044)

4.60 - 5.21

(0.181 - 0.205)

0.36 - 0.51

(0.014 - 0.020)

0.25 - 0.50

(0.010 - 0.020)

0.190 - 0.229

(0.0075 - 0.0090)

Pin Spacing

1.27

(0.050)

(see Note A)

6 places

x 45 ° N0M

8 Places

7 ° NOM

4 Places

7 ° NOM

3 Places

4 ° ± 4 °

DIMENSIONS ARE:

MM

(INCHES)