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TPS28226DRBT Fiches technique(PDF) 5 Page - Texas Instruments

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No de pièce TPS28226DRBT
Description  High-Frequency 4-A Sink Synchronous MOSFET Drivers
Download  35 Pages
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Fabricant  TI [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI - Texas Instruments

TPS28226DRBT Fiches technique(HTML) 5 Page - Texas Instruments

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ABSOLUTE MAXIMUM RATINGS
DISSIPATION RATINGS
(1)
RECOMMENDED OPERATING CONDITIONS
TPS28226
SLUS791 – OCTOBER 2007
over operating free-air temperature range (unless otherwise noted)
(1) (2)
TPS28226
VALUE
UNIT
Input supply voltage range, VDD
(3)
–0.3 to 8.8
Boot voltage, VBOOT
–0.3 to 33
DC
–2 to 32 or VBOOT + 0.3 – VDD whichever is less
Phase voltage, VPHASE
Pulse < 400 ns, E = 20
μJ
–7 to 33.1 or VBOOT + 0.3 – VDD whichever is less
Input voltage range, VPWM, VEN/PG
–0.3 to 13.2
VPHASE – 0.3 to VBOOT + 0.3, (VBOOT – VPHASE < 8.8)
V
Output voltage range, VUGATE
Pulse < 100 ns, E = 2
μJ
VPHASE – 2 to VBOOT + 0.3, (VBOOT – VPHASE < 8.8)
–0.3 to VDD + 0.3
Output voltage range, VLGATE
Pulse < 100 ns, E = 2
μJ
–2 to VDD + 0.3
ESD rating, HBM
2 k
ESD rating, HBM ESD rating, CDM
500
Continuous total power dissipation
See Dissipation Rating Table
Operating virtual junction temperature range, TJ
–40 to 150
Operating ambient temperature range, TA
–40 to 125
°C
Storage temperature, Tstg
–65 to 150
Lead temperature (soldering, 10 sec.)
300
(1)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
These devices are sensitive to electrostatic discharge; follow proper device handling procedures.
(3)
All voltages are with respect to GND unless otherwise noted. Currents are positive into, negative out of the specified terminal. Consult
Packaging Section of the Data book for thermal limitations and considerations of packages.
DERATING FACTOR
TA < 25°C
TA =70°C
TA = 85°C
BOARD
PACKAGE
RθJC
RθJA
ABOVE TA = 25°C
POWER RATING
POWER RATING
POWER RATING
High-K(2)
D
39.4
°C/W
100C/W
10 mW/C
1.25 W
0.8 W
0.65 W
High-K(3)
DRB
1.4
°C/W
48.5C/W
20.6 mW/C
2.58 W
1.65 W
1.34 W
(1)
These thermal data are taken at standard JEDEC test conditions and are useful for the thermal performance comparison of different
packages. The cooling condition and thermal impedance RθJA of practical design is specific.
(2)
The JEDEC test board JESD51-7, 3-inch x 3-inch, 4-layer with 1-oz internal power and ground planes and 2-oz top and bottom trace
layers.
(3)
The JEDEC test board JESD51-5 with direct thermal pad attach, 3-inch x 3-inch, 4-layer with 1-oz internal power and ground planes and
2-oz top and bottom trace layers.
over operating free-air temperature range (unless otherwise noted)
MIN
TYP
MAX
UNIT
VDD
Input supply voltage
6.8
7.2
8
V
VIN
Power input voltage
3
32 V–VDD
TJ
Operating junction temperature range
–40
125
C
Copyright © 2007, Texas Instruments Incorporated
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