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TPS28226DRBT Fiches technique(PDF) 5 Page - Texas Instruments |
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TPS28226DRBT Fiches technique(HTML) 5 Page - Texas Instruments |
5 / 35 page www.ti.com ABSOLUTE MAXIMUM RATINGS DISSIPATION RATINGS (1) RECOMMENDED OPERATING CONDITIONS TPS28226 SLUS791 – OCTOBER 2007 over operating free-air temperature range (unless otherwise noted) (1) (2) TPS28226 VALUE UNIT Input supply voltage range, VDD (3) –0.3 to 8.8 Boot voltage, VBOOT –0.3 to 33 DC –2 to 32 or VBOOT + 0.3 – VDD whichever is less Phase voltage, VPHASE Pulse < 400 ns, E = 20 μJ –7 to 33.1 or VBOOT + 0.3 – VDD whichever is less Input voltage range, VPWM, VEN/PG –0.3 to 13.2 VPHASE – 0.3 to VBOOT + 0.3, (VBOOT – VPHASE < 8.8) V Output voltage range, VUGATE Pulse < 100 ns, E = 2 μJ VPHASE – 2 to VBOOT + 0.3, (VBOOT – VPHASE < 8.8) –0.3 to VDD + 0.3 Output voltage range, VLGATE Pulse < 100 ns, E = 2 μJ –2 to VDD + 0.3 ESD rating, HBM 2 k ESD rating, HBM ESD rating, CDM 500 Continuous total power dissipation See Dissipation Rating Table Operating virtual junction temperature range, TJ –40 to 150 Operating ambient temperature range, TA –40 to 125 °C Storage temperature, Tstg –65 to 150 Lead temperature (soldering, 10 sec.) 300 (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) These devices are sensitive to electrostatic discharge; follow proper device handling procedures. (3) All voltages are with respect to GND unless otherwise noted. Currents are positive into, negative out of the specified terminal. Consult Packaging Section of the Data book for thermal limitations and considerations of packages. DERATING FACTOR TA < 25°C TA =70°C TA = 85°C BOARD PACKAGE RθJC RθJA ABOVE TA = 25°C POWER RATING POWER RATING POWER RATING High-K(2) D 39.4 °C/W 100C/W 10 mW/C 1.25 W 0.8 W 0.65 W High-K(3) DRB 1.4 °C/W 48.5C/W 20.6 mW/C 2.58 W 1.65 W 1.34 W (1) These thermal data are taken at standard JEDEC test conditions and are useful for the thermal performance comparison of different packages. The cooling condition and thermal impedance RθJA of practical design is specific. (2) The JEDEC test board JESD51-7, 3-inch x 3-inch, 4-layer with 1-oz internal power and ground planes and 2-oz top and bottom trace layers. (3) The JEDEC test board JESD51-5 with direct thermal pad attach, 3-inch x 3-inch, 4-layer with 1-oz internal power and ground planes and 2-oz top and bottom trace layers. over operating free-air temperature range (unless otherwise noted) MIN TYP MAX UNIT VDD Input supply voltage 6.8 7.2 8 V VIN Power input voltage 3 32 V–VDD TJ Operating junction temperature range –40 125 C Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Link(s): TPS28226 |
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