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TPS28226 Fiches technique(PDF) 8 Page - Texas Instruments |
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TPS28226 Fiches technique(HTML) 8 Page - Texas Instruments |
8 / 35 page www.ti.com DEVICE INFORMATION 1 2 3 4 8 7 6 5 UGATE BOOT PWM GND PHASE EN/PG VDD LGATE 5 3 7 6 8 1 2 BOOT PWM VDD EN/PG LG A T E GND U G A T E PHASE 4 Exposed Thermal Die Pad 6 13K 2 VDD EN /PG BOOT UGATE PHASE LGATE GND 7 1 8 5 4 VDD 27K 3 −STATE INPUT CIRCUIT PWM 3 SHOOT − THROUGH PROTECTION THERMAL SD HLD−OFF TIME UVLO TPS28226 SLUS791 – OCTOBER 2007 SOIC-8 Package (top view) DRB-8 Package (top view) FUNCTIONAL BLOCK DIAGRAM A. For the TPS28226DRB device the thermal PAD on the bottom side of package must be soldered and connected to the GND pin and to the GND plane of the PCB in the shortest possible way. See Recommended Land Pattern in the Application section. 8 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): TPS28226 |
Numéro de pièce similaire - TPS28226 |
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Description similaire - TPS28226 |
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