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AMC7135SJFA Fiches technique(PDF) 4 Page - ADDtek Corp

No de pièce AMC7135SJFA
Description  350mA ADVANCED CURRENT REGULATOR
Download  6 Pages
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Fabricant  ADDTEK [ADDtek Corp]
Site Internet  https://www.addmtek.com
Logo ADDTEK - ADDtek Corp

AMC7135SJFA Fiches technique(HTML) 4 Page - ADDtek Corp

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AMC7135
Copyright
© 2007 ADDtek Corp.
4
DD031_C -- APRIL 2007
APPLICATION INFORMATION
The Maximum Power Dissipation on Regulator:
PD(MAX) = VOUT(MAX) × IOUT(NOM) + VIN(MAX) × IQ
VOUT(MAX) = the maximum voltage on output pin;
IOUT(NOM) = the nominal output current;
IQ = the quiescent current the regulator consumes at IOUT(MAX);
VIN(MAX) = the maximum input voltage.
Thermal Consideration:
The maximum junction temperature ratings of AMC7135 should not be exceeded under continuous normal load
conditions. When power consumption is over about 700mW (SOT-89 package, at TA=70°C) or 1000mW (TO-252
package, at TA=70°C), additional heat sink is required to control the junction temperature below 120°C.
The junction temperature is:
TJ = PD JT CS SA ) + TA
PD : Dissipated power.
θJT: Thermal resistance from the junction to the mounting tab of the package.
θCS: Thermal resistance through the interface between the IC and the surface on which it is mounted.
(typically, θCS < 1.0°C /W)
θSA: Thermal resistance from the mounting surface to ambient (thermal resistance of the heat sink).
If PC Board copper is going to be used as a heat sink, below table can be used to determine the appropriate size
of copper foil required. For multi-layered PCB, these layers can also be used as a heat sink. They can be connected with
several through-hole vias.
PCB θSA (°C /W)
59
45
38
33
27
24
21
PCB heat sink size (mm2)
500
1000
1500
2000
3000
4000
5000


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