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UAA2080T Datasheet(Fiches technique) 15 Page - NXP Semiconductors

Numéro de pièce UAA2080T
Description  Advanced pager receiver
Télécharger  44 Pages
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Fabricant  PHILIPS [NXP Semiconductors]
Site Internet  http://www.nxp.com
Logo 

 15 page
background image
1996 Jan 15
15
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2080
CHIP DIMENSIONS AND BONDING PAD LOCATIONS
See Table 4 for bonding pad description and locations for x/y co-ordinates.
Fig.9 Bonding pad locations.
Chip area: 18.15 mm2.
Chip thickness: 380
±20 µm.
Drawing not to scale.
handbook, full pagewidth
MLC707
28
1
2
3
4
5
6
7
8
9
10
11
UAA2080U
3.83
mm
4.74 mm
0
0
y
x
24
23
22
21
20
19
18
17
16
15
14
13
12
27
26
25
Where:
µ
Pad number 1 (diameter 124 m)
Pad not used
Pad 124 m x 124 m
µ
µ
Pad 100 m x 100 m
µ
µ
Pad 100 m x 100 m with reference point
µ
µ




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