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SSC-YGFR411-H Fiches technique(PDF) 4 Page - Seoul Semiconductor |
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SSC-YGFR411-H Fiches technique(HTML) 4 Page - Seoul Semiconductor |
4 / 7 page 5. Soldering Profile Reflow Soldering Conditions/ Profile (1) Lead Solder -Preliminary heating to be at 150℃max. for 2 minutes max. -Soldering heat to be at 240℃max. for 5 seconds max. Temperature rise: 5°C/sec. -5°C/sec. Cooling: Pre-heating Operation heating 60 to 120 sec. 5sec. max 120 150 240 °C 0 (2) Lead Free Solder -Preliminary heating to be at 150℃max. for 2 minutes max. -Soldering heat to be at 260℃max. for 10 seconds max. 120 60 to 120 sec. 0 150 °C Pre-heating rise: 5°C/sec. Temperature Operation heating -5°C/sec. Cooling: 260 10 sec. (3) Hand Soldering conditions SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 - 4/7 - SSC-YGFR411-H SSC-QP-0401-06(REV.0) -Not more than 3 seconds @MAX280℃, under Soldering iron. |
Numéro de pièce similaire - SSC-YGFR411-H |
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Description similaire - SSC-YGFR411-H |
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