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TDA6108 Fiches technique(PDF) 10 Page - NXP Semiconductors

No de pièce TDA6108
Description  Triple video output amplifier
Download  16 Pages
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Fabricant  PHILIPS [NXP Semiconductors]
Site Internet  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

TDA6108 Fiches technique(HTML) 10 Page - NXP Semiconductors

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1999 Oct 29
10
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6108JF
External flashover protection
For sufficient flashover protection it is necessary to apply
an external diode and 100
Ω resistor for each channel.
See application note
“Application and Product description
of TDA6107Q/N1” (report number AN96072).
To limit the diode current an external 1 k
Ω carbon
high-voltage resistor in series with the external diode and
a 2 kV spark gap are needed (for this resistor value, the
CRT has to be connected to the main PCB).
VDD must be decoupled to GND:
1. With a capacitor >20 nF with good HF behaviour
(e.g. foil); this capacitor must be placed as close as
possible to pins 6 and 4, but definitely within 5 mm.
2. With a capacitor >3.3
µF on the picture tube base
print.
Switch-off behaviour
The switch-off behaviour of the TDA6108JF is controllable.
This is due to the fact that the output pins of the
TDA6108JF are still under control of the input pins for low
power supply voltages (approximately 30 V and higher).
Bandwidth
The addition of the flash resistor produces a decreased
bandwidth and increases rise and fall times. For further
information, see Application note of the TDA6108JF.
Dissipation
Regarding dissipation, distinction must first be made
between static dissipation (independent of frequency) and
dynamic dissipation (proportional to frequency).
The static dissipation of the TDA6108JF is due to voltage
supply currents and load currents in the feedback network
and CRT.
The static dissipation Pstat equals:
Where:
VDD = supply voltage
IDD = supply current
VO(c) = DC value of cathode voltage
IO(c) = DC value of cathode current.
The dynamic dissipation Pdyn equals:
Where:
CL = load capacitance
Cint = internal load capacitance (≈4 pF)
fi = input frequency
Vo(c)(p-p) = output voltage (peak-to-peak value)
δ = non-blanking duty cycle.
The IC must be mounted on the picture tube base print to
minimize the load capacitance CL.
P
stat
V
DD
I
DD
3V
O(c)
I
O(c)
×
×
+
×
=
P
dyn
3V
DD
C
L
C
int
+
() f
i
V
o(c)(p-p)
δ
×
×
×
×
×
=


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