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TDA4570 Fiches technique(PDF) 8 Page - NXP Semiconductors |
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TDA4570 Fiches technique(HTML) 8 Page - NXP Semiconductors |
8 / 9 page August 1986 8 Philips Semiconductors Product specification NTSC decoder TDA4570 PACKAGE OUTLINE UNIT A max. 1 2 b1 cE e MH L REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm inches DIMENSIONS (inch dimensions are derived from the original mm dimensions) SOT38-1 92-10-02 95-01-19 A min. A max. b max. w ME e 1 1.40 1.14 0.055 0.045 0.53 0.38 0.32 0.23 21.8 21.4 0.86 0.84 6.48 6.20 0.26 0.24 3.9 3.4 0.15 0.13 0.254 2.54 7.62 0.30 8.25 7.80 0.32 0.31 9.5 8.3 0.37 0.33 2.2 0.087 4.7 0.51 3.7 0.15 0.021 0.015 0.013 0.009 0.01 0.10 0.020 0.19 050G09 MO-001AE MH c (e ) 1 ME A L A1 w M b1 e D A2 Z 16 1 9 8 b E pin 1 index 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. (1) (1) D (1) Z DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 |
Numéro de pièce similaire - TDA4570 |
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Description similaire - TDA4570 |
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