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ML0CP18 Fiches technique(PDF) 6 Page - Mitsubishi Electric Semiconductor

No de pièce ML0CP18
Description  10Gb/s EA Modulator Driver IC
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Fabricant  MITSUBISHI [Mitsubishi Electric Semiconductor]
Site Internet  http://www.mitsubishichips.com
Logo MITSUBISHI - Mitsubishi Electric Semiconductor

ML0CP18 Fiches technique(HTML) 6 Page - Mitsubishi Electric Semiconductor

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MITSUBISHI ICs for Optical Communication
M L 0 X X 1 8
10Gb/s EA Modulator Driver IC
MITSUBISHI
ELECTRIC
- 6 -
Notice: This is not a final specification.
Some parametric limits are subject to change.
‘04/1/14 rev.2.1
PACKAGE DESCRIPTION (ML01618)
Figure 5. Package Drawing of 32-pin Small Lead-frame Package (SLP)
Figure 6. Pin assignment of ML01618 (SLP)
• Exposed die pad portion on the back
side of SLP needs to be connected to
GND. In other words, when VEE is
supplied by -5.2V, supply 0V to the die
pad. In the case of positive power
supply (+5.2V to GND terminals and
0V to VEE), supply +5.2V to the die
pad. For the detailed information for
the positive power supply usage,
please contact to your local rep.
• The pins specified as NC need to be
left “OPEN”.
• Pin 21”GNDO”, pin 20”GNDON” and
pin 32”GND” are not connected to
“GND” line inside chip. Connect these
pins to GND externally.
1
2
3
4
5
6
7
8
9
1 0
1 11 2
1 31 4
1 5
1 6
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
IIN B IA S
GN D
DAT A
GN D
GN D
DAT A N
GN D
NC
CSEL
GN D
OU T
G NDO
G NDO N
OU T N
GN D
NC


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