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AMD-K6-2E Fiches technique(PDF) 11 Page - Advanced Micro Devices |
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AMD-K6-2E Fiches technique(HTML) 11 Page - Advanced Micro Devices |
11 / 332 page List of Figures xi 22529B/0—January 2000 AMD-K6™-2E Processor Data Sheet Preliminary Information Figure 85. Debug Registers DR5 and DR4....................................242 Figure 86. Debug Registers DR3, DR2, DR1, and DR0................243 Figure 87. Clock Control State Transitions...................................248 Figure 88. Suggested Component Placement ...............................263 Figure 89. CLK Waveform ..............................................................269 Figure 90. Key to Timing Diagrams ...............................................281 Figure 91. Output Valid Delay Timing ..........................................281 Figure 92. Maximum Float Delay Timing .....................................282 Figure 93. Input Setup and Hold Timing ......................................282 Figure 94. Reset and Configuration Timing .................................283 Figure 95. TCK Timing....................................................................284 Figure 96. TRST# Timing................................................................284 Figure 97. Test Signal Timing ........................................................284 Figure 98. Thermal Model ..............................................................286 Figure 99. Power Consumption v. Thermal Resistance ...............287 Figure 100. Processor Heat Dissipation Path .................................288 Figure 101. Measuring Case Temperature......................................289 Figure 102. Heatsink A (15 mm height) ..........................................290 Figure 103. Heatsink B (20 mm height)...........................................290 Figure 104. Heatsink C (30 mm height) ..........................................290 Figure 105. Measured Thermal Resistance v. Airflow (Socketed 321-Pin CPGA Package) .............................291 Figure 106. Measured Maximum Ambient Temperature (Socketed 321-Pin CPGA Package) .............................292 Figure 107. Measured Thermal Resistance v. Airflow (Soldered 321-Pin CPGA Package)..............................293 Figure 108. Measured Maximum Ambient Temperature (Soldered, 321-Pin CPGA Package).............................294 Figure 109. Voltage Regulator Placement ......................................295 Figure 110. Airflow for a Heatsink with Fan ..................................296 Figure 111. Airflow Path in a Dual-Fan System .............................296 Figure 112. Airflow Path in an ATX Form-Factor System ............297 Figure 113. AMD-K6™-2E Processor Connection Diagram (Top-Side View CPGA) .................................................299 Figure 114. AMD-K6™-2E Processor Connection Diagram (Bottom-Side View CPGA)............................................300 Figure 115. 321-Pin Staggered CPGA Package Specification .......303 |
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Description similaire - AMD-K6-2E |
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