© 2006 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FAN2013 Rev. 1.0.0

3

Absolute Maximum Ratings

Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a

stress rating only; functional operation of the device at these or any other conditions above those indicated in the oper-

ational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended peri-

ods may affect device reliability. Absolute maximum ratings apply individually only, not in combination. Unless

otherwise specified, all other voltages are referenced to AGND.

Notes:

1. Junction-to-ambient thermal resistance,

θ

number of copper planes, number of via used, diameter of via used, available copper surface, and attached heat

sink characteristics.

2. Using Mil Std. 883E, method 3015.7 (Human Body Model) and EIA/JESD22C101-A (Charge Device Model).

Recommended Operating Conditions

Notes:

3. Refer to the Applications Information section for further details.

Symbol

Parameter

Min.

Max.

Unit.

Supply Voltage

-0.3

6.2

V

-0.3

V

θ

JC

8°C/W

Lead Soldering Temperature (10 seconds)

260

°C

Storage Temperature

-65

150

°C

Junction Temperature

-40

150

°C

HBM

3.5

kV

CDM

2

Symbol

Parameter

Min.

Typ.

Max.

Unit

Supply Voltage Range

4.5

5.5

V

Output Voltage Range, Adjustable Version

0.8

V

Output Current

2.0

A

L

2.2

μH

10

20

μF

20

40

μF

Operating Ambient Temperature Range

-40

+85

°C