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BYD43U Fiches technique(PDF) 2 Page - NXP Semiconductors

No de pièce BYD43U
Description  Fast soft-recovery rectifiers
Download  11 Pages
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Fabricant  PHILIPS [NXP Semiconductors]
Site Internet  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BYD43U Fiches technique(HTML) 2 Page - NXP Semiconductors

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1996 Jun 05
2
Philips Semiconductors
Product specification
Fast soft-recovery rectifiers
BYD43 series
FEATURES
• Glass passivated
• High maximum operating
temperature
• Low leakage current
• Excellent stability
• Available in ammo-pack.
DESCRIPTION
Cavity free cylindrical glass package
through Implotec
(1) technology.
This package is hermetically sealed
and fatigue free as coefficients of
expansion of all used parts are
matched.
(1) Implotec is a trademark of Philips.
Fig.1 Simplified outline (SOD81) and symbol.
handbook, 4 columns
a
k
MAM123
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VRSM
non-repetitive peak reverse voltage
BYD43U
1300
V
BYD43V
1500
V
BYD43-16
1700
V
BYD43-18
1900
V
BYD43-20
2100
V
VRRM
repetitive peak reverse voltage
BYD43U
1200
V
BYD43V
1400
V
BYD43-16
1600
V
BYD43-18
1800
V
BYD43-20
2000
V
IF(AV)
average forward current
Ttp =55 °C; lead length = 10 mm;
see Figs 2 and 3;
averaged over any 20 ms period;
see also Figs 10 and 11
BYD43U and V
1.20
A
BYD43-16 to 20
0.68
A
IF(AV)
average forward current
Tamb =65 °C; PCB mounting (see
Fig.20); see Figs 4 and 5;
averaged over any 20 ms period;
see also Figs 10 and 11
BYD43U and V
0.65
A
BYD43-16 to 20
0.30
A
IFRM
repetitive peak forward current
Ttp =55 °C; see Figs 6 and 7
BYD43U and V
11
A
BYD43-16 to 20
6A
IFRM
repetitive peak forward current
Tamb =65 °C; see Figs 8 and 9
BYD43U and V
6.0
A
BYD43-16 to 20
3.2
A


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