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MC100LVELT22D Fiches technique(PDF) 2 Page - ON Semiconductor |
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MC100LVELT22D Fiches technique(HTML) 2 Page - ON Semiconductor |
2 / 7 page MC100LVELT22 http://onsemi.com 2 1 2 3 45 6 7 8 D0 GND VCC Q0 D1 Q1 Q1 Q0 LVPECL LVTTL/ LVCMOS Figure 1. 8−Lead Pinout (Top View) and Logic Diagram PIN FUNCTION Table 1. PIN DESCRIPTION Qn, Qn LVPECL Differential Outputs D0, D1 LVTTL/LVCMOS Inputs VCC Positive Supply GND Ground EP Exposed pad must be connected to a sufficient thermal conduit. Electrically connect to the most negative supply or leave floating open. EP Table 2. ATTRIBUTES Characteristics Value Internal Input Pulldown Resistor N/A Internal Input Pullup Resistor N/A ESD Protection Human Body Model Machine Model > 4 kV > 200 V Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Level 1 Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Transistor Count 164 Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. Table 3. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Unit VCC Positive Power Supply GND = 0 V 7 V VI Input Voltage GND = 0 V VI VCC 7 V Iout Output Current Continuous Surge 50 100 mA mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm SO−8 SO−8 190 130 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) std bd SO−8 41 to 44 ± 5% °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm TSSOP−8 TSSOP−8 185 140 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) std bd TSSOP−8 41 to 44 ± 5% °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm DFN8 DFN8 129 84 °C/W °C/W Tsol Wave Solder Pb Pb−Free <2 to 3 sec @ 248 °C <2 to 3 sec @ 260 °C 265 265 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. |
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