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MC100EP139MNTXG Fiches technique(PDF) 4 Page - ON Semiconductor |
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4 / 14 page MC10EP139, MC100EP139 http://onsemi.com 4 Table 3. ATTRIBUTES Characteristics Value Internal Input Pulldown Resistor 75 kW Internal Input Pullup Resistor N/A ESD Protection Human Body Model Machine Model Charged Device Model > 2 kV > 100 V > 2 kV Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Pb Pkg Pb−Free Pkg SOIC−20 TSSOP−20 QFN−20 Level 1 Level 1 N/A Level 3 Level 1 Level Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Transistor Count 758 Devices Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. Table 4. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Unit VCC PECL Mode Power Supply VEE = 0 V 6 V VEE NECL Mode Power Supply VCC = 0 V −6 V VI PECL Mode Input Voltage NECL Mode Input Voltage VEE = 0 V VCC = 0 V VI v VCC VI w VEE 6 −6 V V Iout Output Current Continuous Surge 50 100 mA mA IBB VBB Sink/Source ± 0.5 mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm TSSOP−20 TSSOP−20 140 100 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board TSSOP−20 23 to 41 °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm SOIC−20 SOIC−20 90 60 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board SOIC−20 33 to 35 °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm QFN−20 QFN−20 90 60 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board QFN−20 33 to 35 °C/W Tsol Wave Solder Pb Pb−Free <2 to 3 sec @ 248°C <2 to 3 sec @ 260°C 265 265 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. |
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