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MC100EP16VADR2G Fiches technique(PDF) 10 Page - ON Semiconductor |
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MC100EP16VADR2G Fiches technique(HTML) 10 Page - ON Semiconductor |
10 / 11 page ![]() MC10EP16VA, MC100EP16VA http://onsemi.com 10 PACKAGE DIMENSIONS DIM MIN MAX MIN MAX INCHES MILLIMETERS A 2.90 3.10 0.114 0.122 B 2.90 3.10 0.114 0.122 C 0.80 1.10 0.031 0.043 D 0.05 0.15 0.002 0.006 F 0.40 0.70 0.016 0.028 G 0.65 BSC 0.026 BSC L 4.90 BSC 0.193 BSC M 0 6 0 6 ___ _ SEATING PLANE PIN 1 1 4 85 DETAIL E B C D A G DETAIL E F M L 2X L/2 −U− S U 0.15 (0.006) T S U 0.15 (0.006) T S U M 0.10 (0.004) V S T 0.10 (0.004) −T− −V− −W− 0.25 (0.010) 8x REF K IDENT K 0.25 0.40 0.010 0.016 TSSOP−8 DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948R−02 ISSUE A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. |
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Description similaire - MC100EP16VADR2G |
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