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TPS2231RGPR Fiches technique(PDF) 2 Page - Texas Instruments |
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TPS2231RGPR Fiches technique(HTML) 2 Page - Texas Instruments |
2 / 35 page www.ti.com ABSOLUTE MAXIMUM RATINGS DISSIPATION RATINGS (Thermal Resistance = °C/W) TPS2231 TPS2236 SLVS536E – JULY 2004 – REVISED SEPTEMBER 2006 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. AVAILABLE OPTIONS PACKAGED DEVICES(1) TA NUMBER OF CHANNELS TSSOP PowerPAD HTSSOP QFN TPS2231RGP Single TPS2231PW TPS2231PWP –40°C to 85°C TPS2231MRGP(2) Dual TPS2236DAP (1) The package is available taped and reeled. Add an R suffix to device types (e.g., TPS2231PWPR). (2) The TPS2231MRGP is identical to the TPS2231RGP with the exception of the PowerPAD dimensions. See the Thermal Pad Mechanical data portion of this data sheet for specific information. over operating free-air temperature range (unless otherwise noted)(1) TPS223x UNIT VI(3.3VIN) –0.3 to 6 V Input voltage range for card VI VI(1.5VIN) –0.3 to 6 V power VI(AUXIN) –0.3 to 6 V Logic input/output voltage –0.3 to 6 V VO(3.3VOUT) –0.3 to 6 V VO Output voltage range VO(1.5VOUT) –0.3 to 6 V VO(AUXOUT) –0.3 to 6 V Continuous total power dissipation See Dissipation Rating Table IO(3.3VOUT) Internally limited IO Output current IO(AUXOUT) Internally limited IO(1.5VOUT) Internally limited OC sink current 10 mA PERST sink/source current 10 mA TJ Operating virtual junction temperature range –40 to 120 °C Tstg Storage temperature range –55 to 150 °C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 °C TPS2231 2 kV Human body model TPS2236, all pins except Electrostatic discharge (HBM) MIL-STD-883C PERSTx and OCx ESD protection TPS2236, PERSTx and OCx 1.5 kV Charge device model (CDM) 500 V (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. TA ≤ 25°C DERATING FACTOR TA = 70°C TA = 85°C PACKAGE POWER RATING ABOVE TA = 25°C POWER RATING POWER RATING PW (20)(1) 704.2 mW 7.41 mW/°C 370.6 mW 259.5 mW PWP (24)(1) 3153 mW 33.19 mW/°C 1659.5 mW 1161.6 mW (1) These devices are mounted on an JEDEC low-k board (2-oz. traces on surface), (The table is assuming that the maximum junction temperature is 120°C). The power pad on the device must be soldered down to the power pad on the board if best thermal performance is needed. 2 Submit Documentation Feedback |
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