AD8112-EVALZ1 datasheet(7/28 Pages) AD

No de pièce	AD8112-EVALZ1

Description	Audio/Video, 60 MHz, 16 횞 8, Gain of 2 Crosspoint Switch

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Fabricant	AD [Analog Devices]

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AD8112

Rev. 0 | Page 7 of 28

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

Rating

Analog Supply Voltage (AVCC to AVEE)

26.0 V

Digital Supply Voltage (DVCC to DGND)

6 V

Ground Potential Difference (AGND to DGND)

±0.5 V

Internal Power Dissipation1

3.1 W

Analog Input Voltage2

Maintain linear output

Digital Input Voltage

DVCC

Output Voltage (Disabled Output)

(AVCC − 1.5 V) to

(AVEE + 1.5 V)

Output Short-Circuit Duration

Momentary

Storage Temperature Range

−65°C to +125°C

Lead Temperature (Soldering 10 sec)

300°C

1 Specification is for device in free air (TA = 25°C):

100-lead plastic LQFP (ST): θJA = 40°C/W.

2 To avoid differential input breakdown, ensure that one-half the output

voltage (1/2 VOUT) and any input voltage is less than 10 V of the potential

differential. See Output Voltage Swing specification for linear output range.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

ESD CAUTION

POWER DISSIPATION

The AD8112 is operated with ±5 V to ±12 V supplies and can

drive loads down to 150 Ω (±5 V) or 600 Ω (±12 V), resulting

in a large range of possible power dissipations. For this reason,

extra care must be taken when derating the operating conditions

based on ambient temperature.

Packaged in a 100-lead LQFP, the AD8112 junction-to-ambient

thermal impedance (θJA) is 40°C/W. For long-term reliability,

the maximum allowed junction temperature of the plastic encap-

sulated die should not exceed 150°C. Temporarily exceeding

this limit may cause a shift in parametric performance due

to a change in the stresses exerted on the die by the package.

Exceeding a junction temperature of 175°C for an extended

period can result in device failure. The curve in Figure 4 shows

the range of allowed power dissipations that meet these conditions

over the commercial range of ambient temperatures.

4.0

3.5

2.0

3.0

2.5

AMBIENT TEMPERATURE (°C)

0

10

203040

5060

70

TJ = 150°C

Figure 4. Maximum Power Dissipation vs. Ambient Temperature

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