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74HCT356 Fiches technique(PDF) 2 Page - NXP Semiconductors

No de pièce 74HCT356
Description  8-input multiplexer/register; 3-state
Download  13 Pages
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Fabricant  PHILIPS [NXP Semiconductors]
Site Internet  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

74HCT356 Fiches technique(HTML) 2 Page - NXP Semiconductors

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December 1990
2
Philips Semiconductors
Product specification
8-input multiplexer/register; 3-state
74HC/HCT356
FEATURES
• Non-transparent data latches
• Transparent address latch
• Easily expanding
• Complementary outputs
• Output capability: bus driver
• ICC category: MSI
GENERAL DESCRIPTION
The 74HC/HCT356 are high-speed Si-gate CMOS devices
and are pin compatible with low power Schottky TTL
(LSTTL). They are specified in compliance with JEDEC
standard no. 7A.
The 74HC/HCT356 data selectors/multiplexers contain full
on-chip binary decoding, to select one-of-eight data
sources. The data select address is stored in transparent
latches that are enabled by a LOW on the latch enable
input LE.
Data on the 8 input lines (D0 to D7) is clocked into a
edge-triggered data register by a LOW-to-HIGH transition
of the clock (CP).
When the output enable input OE1 = HIGH, OE2 = HIGH
or OE3 = LOW, the outputs go to the high impedance
OFF-state.
Operation of these output enable inputs does not affect the
state of the latches and register.
QUICK REFERENCE DATA
GND = 0 V; Tamb =25 °C; tr =tf = 6 ns
Notes
1. CPD is used to determine the dynamic power dissipation (PD in µW):
PD =CPD × VCC2 × fi + ∑ (CL × VCC2 × fo) where:
fi = input frequency in MHz
fo = output frequency in MHz
∑ (CL × VCC2 × fo) = sum of outputs
CL = output load capacitance in pF
VCC = supply voltage in V
2. For HC the condition is VI = GND to VCC
For HCT the condition is VI = GND to VCC − 1.5 V
ORDERING INFORMATION
See
“74HC/HCT/HCU/HCMOS Logic Package Information”.
SYMBOL
PARAMETER
CONDITIONS
TYPICAL
UNIT
HC
HCT
tPHL/ tPLH
propagation delay
CL = 15 pF; VCC =5 V
Sn, LE to Y, Y24
25
ns
CP to Y, Y20
22
ns
CI
input capacitance
3.5
3.5
pF
CPD
power dissipation capacitance per package
notes 1 and 2
123
125
pF


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