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H03N60F Fiches technique(PDF) 4 Page - Hi-Sincerity Mocroelectronics

No de pièce H03N60F
Description  N-Channel Power Field Effect Transistor
Download  5 Pages
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Fabricant  HSMC [Hi-Sincerity Mocroelectronics]
Site Internet  http://www.hsmc.com.tw
Logo HSMC - Hi-Sincerity Mocroelectronics

H03N60F Fiches technique(HTML) 4 Page - Hi-Sincerity Mocroelectronics

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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : MOS200602
Issued Date : 2006.02.01
Revised Date : 2006.02.07
Page No. : 4/5
H03N60E, H03N60F
HSMC Product Specification
TO-220AB Dimension
TO-220FP Dimension
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-2521-2056 Fax: 886-2-2563-2712
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-598-3621~5 Fax: 886-3-598-2931
A
B
E
G
I
K
M
O
P
3
2
1
C
N
H
D
Tab
F
J
L
Marking:
Control Code
Date Code
H
03
Pb Free Mark
Pb-Free: "
. " (Note)
Normal: None
N6
E
0
Note: Green label is used for pb-free packing
Pin Style: 1.Gate 2 & Tab.Drain 3.Source
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
3-Lead TO-220AB
Plastic Package
HSMC Package Code: E
DIM
Min.
Max.
A
5.58
7.49
B
8.38
8.90
C
4.40
4.70
D
1.15
1.39
E
0.35
0.60
F
2.03
2.92
G
9.66
10.28
H
-
*16.25
I-
*3.83
J
3.00
4.00
K
0.75
0.95
L
2.54
3.42
M
1.14
1.40
N-
*2.54
O
12.70
14.27
P
14.48
15.87
*: Typical, Unit: mm
Marking:
Control Code
Date Code
H
03
Pb Free Mark
Pb-Free: "
. " (Note)
Normal: None
N6
F
0
Note: Green label is used for pb-free packing
Pin Style: 1.Gate 2.Drain 3.Source
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
3-Lead TO-220FP
Plastic Package
HSMC Package Code: F
A
D
F
G
I
K
L
M
3
2
1
C
J
N
α3
E
α2
O
α4
α5
α1
DIM
Min.
Max.
A
6.48
7.40
C
4.40
4.90
D
2.34
3.00
E
0.45
0.80
F
9.80
10.36
G
3.10
3.60
I
2.70
3.43
J
0.60
1.00
K
2.34
2.74
L
12.48
13.60
M
15.67
16.20
N
0.90
1.47
O
2.00
2.96
α1/2/4/5
-*5o
α3
-*27o
*: Typical, Unit: mm


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