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SI5449DC Fiches technique(PDF) 1 Page - Vishay Siliconix |
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SI5449DC Fiches technique(HTML) 1 Page - Vishay Siliconix |
1 / 4 page Si5449DC Vishay Siliconix Document Number: 71327 S-21251—Rev. B, 05-Aug-02 www.vishay.com 1 P-Channel 30-V (D-S) MOSFET PRODUCT SUMMARY VDS (V) rDS(on) (Ω) ID (A) --30 0.085 @ VGS =--4.5 V --4.3 --30 0.135 @ VGS =--2.5 V --3.4 1206-8 ChipFETt t t t D D D G D D D S 1 Bottom View S G D P-Channel MOSFET Marking Code BH XX Lot Traceability and Date Code Part # Code Ordering Information: Si5449DC-T1 ABSOLUTE MAXIMUM RATINGS (TA =25_C UNLESS OTHERWISE NOTED) Parameter Symbol 5 secs Steady State Unit Drain-Source Voltage VDS --30 V Gate-Source Voltage VGS 12 V Continuous Drain Current (TJ = 150_C)a TA =25_C ID --4.3 --3.1 Continuous Drain Current (TJ = 150_C)a TA =85_C ID --3.1 --2.2 A Pulsed Drain Current IDM --15 A Continuous Source Currenta IAS --2.1 --1.1 Maximum Power Dissipationa TA =25_C PD 2.5 1.3 W Maximum Power Dissipationa TA =85_C PD 1.3 0.7 W Operating Junction and Storage Temperature Range TJ,Tstg --55 to 150 _ C Soldering Recommendations (Peak Temperature)b, c 260 _ C THERMAL RESISTANCE RATINGS Parameter Symbol Typical Maximum Unit M i J ti t A bi ta t ≤ 5sec R 40 50 Maximum Junction-to-Ambienta Steady State RthJA 80 95 _ C/W Maximum Junction-to-Foot (Drain) Steady State RthJF 15 20 C/ Notes a. Surface Mounted on 1” x 1” FR4 Board. b. See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singula- tion process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder inter- connection. c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components. |
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