Advanced Clock Drivers Devices

Freescale Semiconductor

3

MC100ES6210

Table 3. General Specifications

Symbol

Characteristics

Min

Typ

Max

Unit

Condition

Output Termination Voltage

V

MM

ESD Protection (Machine Model)

200

V

HBM

ESD Protection (Human Body Model)

2000

V

CDM

ESD Protection (Charged Device Model)

V

LU

Latch-Up Immunity

200

mA

Input Capacitance

4.0

pF

Inputs

Thermal Resistance Junction to Ambient

JESD 51-3, single layer test board

JESD 51-6, 2S2P multilayer test board

83.1

73.3

68.9

63.8

57.4

59.0

54.4

52.5

50.4

47.8

86.0

75.4

70.9

65.3

59.6

60.6

55.7

53.8

51.5

48.8

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

Natural convection

100 ft/min

200 ft/min

400 ft/min

800 ft/min

Natural convection

100 ft/min

200 ft/min

400 ft/min

800 ft/min

Thermal Resistance Junction to Case

23.0

26.3

°C/W

MIL-SPEC 883E

Method 1012.1

(continuous operation)

MTBF = 9.1 years

2. Operating junction temperature impacts device life time. Maximum continuous operating junction temperature should be selected according

to the application life time requirements (See application note AN1545 for more information). The device AC and DC parameters are

specified up to 110

°C junction temperature allowing the MC100ES6210 to be used in applications requiring industrial temperature range. It

is recommended that users of the MC100ES6210 employ thermal modeling analysis to assist in applying the junction temperature

specifications to their particular application.

110

°C

Symbol

Characteristics

Min

Typ

Max

Unit

Condition

Clock Input Pair CLKA, CLKA, CLKB, CLKB (PECL differential signals)

0.1

1.3

V

Differential operation

1.0

V

Differential operation

±100

PECL Clock Outputs (QA0-4, QA0-4, QB0-4, QB0-4)

Output High Voltage

V

3. Equivalent to a termination of 50

Output Low Voltage

Maximum Quiescent Supply Current

without Output Termination Current

60

100

mA

Output Reference Voltage

V