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TS39100CP Fiches technique(PDF) 3 Page - Taiwan Semiconductor Company, Ltd |
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TS39100CP Fiches technique(HTML) 3 Page - Taiwan Semiconductor Company, Ltd |
3 / 10 page TS39100/1/2/3 3-10 2004/06 rev. E Thermal Performance Condition Package type Typ Unit SOT-223 15 SOP-8 20 Thermal Resistance Junction to Ambient TO-252 25 oC/W Note 1: Absolute Maximum Rating is limits beyond which damage to the device may occur. For guaranteed specifications and test conditions see the Electrical Characteristics. Note 2: The device is not guaranteed to operate outside its operating rating. Note 3: Devices are ESD sensitive. Handling precautions recommended. Note 4: The maximum allowable power dissipation is a function of the maximum junction temperature, Tj, the junction to ambient thermal resistance, θja, and the ambient temperature, Ta. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. The effective value of θja can be reduced by using a heatsink, Pd(max) = (Tj(max) – Ta) / Θja. Note 5: Dropout voltage is defined as the input to output differential at which the output voltage drops -1% below its nominal value measured at 1V differential. Note 6: Ground pin current is the regulator quiescent current. The total current drawn from the source is the sum of the ground pin current and output load current, Iin = Ignd + Iout. Note 7: Vref ≤ Vout ≤ (Vin – 1V), 2.25V ≤ Vin ≤ 16V, 10mA ≤ IL ≤ 1.0A. Note 8: Output voltage temperature coefficient is ∆Vout (worse cast) / (Tj(max) - Tj(min)) where is Tj(max) +125 oC and Tj(min) is 0 oC. Note 9: For adjustable device and fiexed device with Vout > 2.25V. Block Diagram TS39100 |
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