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OPA991 Fiches technique(PDF) 55 Page - Texas Instruments |
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OPA991 Fiches technique(HTML) 55 Page - Texas Instruments |
55 / 59 page www.ti.com EXAMPLE STENCIL DESIGN (R0.05) TYP 8X (0.25) 8X (0.5) (0.9) (0.7) (1.9) (0.45) 6X (0.5) WSON - 0.8 mm max height DSG0008A PLASTIC SMALL OUTLINE - NO LEAD 4218900/D 04/2020 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 9: 87% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:25X SYMM 1 4 5 8 METAL SYMM 9 |
Numéro de pièce similaire - OPA991_V01 |
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Description similaire - OPA991_V01 |
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