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ADC11DL066 Fiches technique(PDF) 4 Page - National Semiconductor (TI) |
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ADC11DL066 Fiches technique(HTML) 4 Page - National Semiconductor (TI) |
4 / 23 page Pin Descriptions and Equivalent Circuits (Continued) Pin No. Symbol Equivalent Circuit Description 25–29 34–39 DA0–DA10 Digital data output pins that make up the 11-bit conversion results of their respective converters. DA0 and DB0 are the LSBs, while DA10 and DB10 are the MSBs of the output words. Output levels are TTL/CMOS compatible. 43–47 52–57 DB0–DB10 ANALOG POWER 9, 18, 19, 62, 63 V A Positive analog supply pins. These pins should be connected to a quiet +3.3V source and bypassed to AGND with 0.1 µF capacitors located within 1 cm of these power pins, and with a 10 µF capacitor. 3, 8, 10, 17, 20, 61, 64 AGND The ground return for the analog supply. DIGITAL POWER 33, 48 V D Positive digital supply pin. This pin should be connected to the same quiet +3.3V source as is V A and be bypassed to DGND with a 0.1 µF capacitor located within 1 cm of the power pin and with a 10 µF capacitor. 32, 49 DGND The ground return for the digital supply. 24, 42 DGND These two pins are grounded internally and may be grounded or left unconnected. 30, 51 V DR Positive digital supply pin for the ADC11DL066’s output drivers. This pin should be connected to a voltage source of +2.4V to V D and be bypassed to DR GND with a 0.1 µF capacitor. If the supply for this pin is different from the supply used for V A and VD, it should also be bypassed with a 10 µF tantalum capacitor. V DR should never exceed the voltage on V D. All bypass capacitors should be located within 1 cm of the supply pin. 23, 31, 40, 50, 58 DR GND The ground return for the digital supply for the ADC11DL066’s output drivers. These pins should be connected to the system digital ground, but not be connected in close proximity to the ADC11DL066’s DGND or AGND pins. See Section 5 (Layout and Grounding) for more details. www.national.com 4 |
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