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AD8152JBP Fiches technique(PDF) 3 Page - Analog Devices

No de pièce AD8152JBP
Description  34 x 34, 3.2 Gbps Asynchronous Digital Crosspoint Switch
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Fabricant  AD [Analog Devices]
Site Internet  http://www.analog.com
Logo AD - Analog Devices

AD8152JBP Fiches technique(HTML) 3 Page - Analog Devices

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REV. A
AD8152
–3–
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
AD8152 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
ABSOLUTE MAXIMUM RATINGS
1
VCC to VEE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.7 V
VTTI
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC + 0.6 V
VTTO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC + 0.6 V
Internal Power Dissipation
2
AD8152 256-Ball SBGA (BP) . . . . . . . . . . . . . . . . . . 8.33 W
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC + 0.6 V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . 1.7 V
Logic Input Voltage . . . . . . VEE – 0.3 V < VIN < VCC + 0.6 V
Storage Temperature Range . . . . . . . . . . . . . –65
°C to +125°C
Lead Temperature Range . . . . . . . . . . . . . . . . . . . . . . . 300
°C
NOTES
1 Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2 Specification is for the device in free air (T
A = 25
°C):
JA = 15
°C/W @ still air.
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the AD8152 is
limited by the associated rise in junction temperature. The maxi-
mum safe junction temperature for plastic encapsulated devices
is determined by the glass transition temperature of the plastic,
approximately 150
°C. Temporarily exceeding this limit may cause
16
0
090
10
20
30
40
50
60
70
80
14
8
6
4
2
12
10
AMBIENT TEMPERATURE – C
Tj = 150 C
400 lfpm
200 lfpm
STILL AIR
Figure 2. Maximum Power Dissipation vs. Temperature
a shift in parametric performance due to a change in the stresses
exerted on the die by the package. Exceeding a junction tem-
perature of 175
°C for an extended period can result in device
failure. To ensure proper operation, it is necessary to observe the
maximum power derating curves shown in Figure 2.
ORDERING GUIDE
Model
Temperature Range
Package Description
AD8152JBP
0
°C to 85°C
256-Ball SBGA (27 mm
× 27 mm)
AD8152-EVAL
Evaluation Board


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