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AD8152JBP Fiches technique(PDF) 3 Page - Analog Devices |
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AD8152JBP Fiches technique(HTML) 3 Page - Analog Devices |
3 / 32 page REV. A AD8152 –3– CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD8152 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. ABSOLUTE MAXIMUM RATINGS 1 VCC to VEE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.7 V VTTI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC + 0.6 V VTTO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC + 0.6 V Internal Power Dissipation 2 AD8152 256-Ball SBGA (BP) . . . . . . . . . . . . . . . . . . 8.33 W Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC + 0.6 V Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . 1.7 V Logic Input Voltage . . . . . . VEE – 0.3 V < VIN < VCC + 0.6 V Storage Temperature Range . . . . . . . . . . . . . –65 °C to +125°C Lead Temperature Range . . . . . . . . . . . . . . . . . . . . . . . 300 °C NOTES 1 Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2 Specification is for the device in free air (T A = 25 °C): JA = 15 °C/W @ still air. MAXIMUM POWER DISSIPATION The maximum power that can be safely dissipated by the AD8152 is limited by the associated rise in junction temperature. The maxi- mum safe junction temperature for plastic encapsulated devices is determined by the glass transition temperature of the plastic, approximately 150 °C. Temporarily exceeding this limit may cause 16 0 090 10 20 30 40 50 60 70 80 14 8 6 4 2 12 10 AMBIENT TEMPERATURE – C Tj = 150 C 400 lfpm 200 lfpm STILL AIR Figure 2. Maximum Power Dissipation vs. Temperature a shift in parametric performance due to a change in the stresses exerted on the die by the package. Exceeding a junction tem- perature of 175 °C for an extended period can result in device failure. To ensure proper operation, it is necessary to observe the maximum power derating curves shown in Figure 2. ORDERING GUIDE Model Temperature Range Package Description AD8152JBP 0 °C to 85°C 256-Ball SBGA (27 mm × 27 mm) AD8152-EVAL Evaluation Board |
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