4

TPS63810

SLVSEK4 – JULY 2019

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Copyright © 2019, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal, unless otherwise noted.

6 Specifications

6.1 Absolute Maximum Ratings

over operating junction temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–0.3

6

V

–3

9

V

Operating junction temperature

–40

150

°C

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

±500

(1)

The device can sustain the maximum recommended output current only for short durations before its junction temperature gets too hot.

Users must verify that the thermal performance of the end application can support the maximum output current.

(2)

Effective capacitance after DC bias effects have been considered.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

2.2

5.5

V

Output voltage

1.825

5

V

High-level input voltage

SCL, SDA, VSEL

1.3

V

Low-level input voltage

SCL, SDA, VSEL

0

0.3

V

Input voltage

EN

0

V

2.5

A

2

A

2.5

A

5

µF

16

µF

L

Inductance

390

470

560

nH

Operating free-air temperature range

–40

85

°C

Operating junction temperature range

–40

125

°C