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TPD4E001 Fiches technique(PDF) 4 Page - Texas Instruments |
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TPD4E001 Fiches technique(HTML) 4 Page - Texas Instruments |
4 / 30 page 1 2 3 6 5 4 IO1 VCC IO2 IO3 GND IO4 IO3 GND V CC IO4 1 2 6 3 5 4 IO1 IO2 IO1 IO2 GND V CC IO4 IO3 1 2 3 4 5 6 IO3 IO2 V CC IO4 1 2 6 3 5 4 IO1 GND IO1 IO2 GND V CC IO4 IO3 GND 1 2 3 4 5 6 IO3 GND V CC IO4 1 2 6 3 5 4 IO2 IO1 4 TPD4E001 SLLS682O – JULY 2006 – REVISED JULY 2019 www.ti.com Product Folder Links: TPD4E001 Submit Documentation Feedback Copyright © 2006–2019, Texas Instruments Incorporated 5 Pin Configuration and Functions DRL Package 6-Pin SOT Top View DCK2 Package 6-Pin SC70 Top View DBV or DCK Package 6-Pin SOT or SC70 Top View DRS Package 6-Pin SON Top View DPK Package 6-Pin USON Top View TPD4E001R DBV Package 6-Pin SOT Top View Pin Functions PIN I/O DESCRIPTION NAME DRS, DRL, DPK DBV, DCK TPD4E001R GND 3 2 5 — Ground IOx 1 1 1 I ESD-protected channel 2 3 3 4 4 4 5 6 6 VCC 6 5 2 I Power-supply input. Bypass VCC to GND with a 0.1-μF ceramic capacitor Exposed thermal pad (DRS package only) — Exposed thermal pad. Connect to GND or leave floating |
Numéro de pièce similaire - TPD4E001_V02 |
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Description similaire - TPD4E001_V02 |
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