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VLMP31G2J1-GS08 Fiches technique(PDF) 5 Page - HK TO-GRACE TECHNOLOGY CO.,LTD. |
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VLMP31G2J1-GS08 Fiches technique(HTML) 5 Page - HK TO-GRACE TECHNOLOGY CO.,LTD. |
5 / 7 page VLMP31.. www.vishay.com Vishay Semiconductors Rev. 1.6, 03-Aug-15 5 Document Number: 81328 For technical questions, contact: LED@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 METHOD OF TAPING / POLARITY AND TAPE AND REEL SMD LED (VLM.3-SERIES) Vishay’s LEDs in SMD packages are available in an antistatic 8 mm blister tape (in accordance with DIN IEC 40 (CO) 564) for automatic component insertion. The blister tape is a plastic strip with impressed component cavities, covered by a top tape. TAPING OF VLM.3... Fig. 8 - Tape Dimensions in mm for PLCC-2 REEL PACKAGE DIMENSION IN MILLIMETERS FOR SMD LEDS, TAPE OPTION GS08 (= 1500 PCS.) Fig. 9 - Reel Dimensions - GS08 REEL PACKAGE DIMENSION IN MILLIMETERS FOR SMD LEDS, TAPE OPTION GS18 (= 8000 PCS.) PREFERRED Fig. 10 - Reel Dimensions - GS18 SOLDERING PROFILE Fig. 11 - Vishay Lead (Pb)-free Reflow Soldering Profile (acc. to J-STD-020) Fig. 12 - Double Wave Soldering of Opto Devices (all Packages) Adhesive tape Component cavity Blister tape 94 8670 1.85 1.65 4.0 3.6 3.6 3.4 2.05 1.95 1.6 1.4 4.1 3.9 4.1 3.9 5.75 5.25 8.3 7.7 3.5 3.1 2.2 2.0 0.25 94 8668 180 178 4.5 3.5 2.5 1.5 13.00 12.75 63.5 60.5 14.4 max. 10.0 9.0 120° 94 8665 Identification Label: Vishay type group tape code production code quantity 321 329 Identification 4.5 3.5 2.5 1.5 13.00 12.75 62.5 60.0 14.4 max. 10.4 8.4 120° 18857 Label: Vishay type group tape code production code quantity 0 50 100 150 200 250 300 0 50 100 150 200 250 300 Time (s) 240 °C 245 °C max. 260 °C max. 120 s max. 100 s 217 °C max. 30 s max. ramp up 3 °C/s max. ramp down 6 °C/s 19885 IR Reflow Soldering Profile for Lead (Pb)-free Soldering Preconditioning acc. to JEDEC level 2a max. 2 cycles allowed 255 °C 235 °C to 260 °C 2 K/s ca. 200 K/s second wave first wave 5 s full line: typical dotted line: process limits Time (s) lead temperature 300 250 200 150 100 50 0 0 50 100 150 200 250 948626-1 TTW Soldering (acc. to CECC00802) 100 °C to 130 °C forced cooling ca. 2 K/s ca. 5 K/s |
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Description similaire - VLMP31G2J1-GS08 |
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