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ADUCM330WFS Datasheet(Fiches technique) 12 Page - Analog Devices

Numéro de pièce ADUCM330WFS
Description  Integrated, Precision Battery Sensor for Automotive Systems
Télécharger  17 Pages
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Fabricant  AD [Analog Devices]
Site Internet  http://www.analog.com
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ADuCM330WFS/ADuCM331WFS
Data Sheet
Rev. A | Page 12 of 17
ABSOLUTE MAXIMUM RATINGS
The ADuCM330WFS/ADuCM331WFS operate directly from
the 12 V battery supply and is fully specified over the −40°C to
+115°C temperature range, unless otherwise noted.
Table 2.
Parameter
Rating
AGND to DGND to VSS to IO_VSS
−0.3 V to +0.3 V
VBAT to AGND
−22 V to +40 V
VDD to VSS
−0.3 V to +40 V
LIN to IO_VSS
−18 V to +40 V
Digital Input and Output Voltage to
DGND
−0.3 V to DVDD33 + 0.3 V
ADC Inputs to AGND
−0.3 V to AVDD18 + 0.3 V
ESD Rating
Human Body Model (HBM) Rating1
HBM-ADI0082
All Pins Except LIN and VBAT
±2.0 kV
LIN
±6 kV
VBAT
±4 kV
IEC 61000-4-2
LIN and VBAT
±8 kV
Storage Temperature Range
−55°C to +150°C
Junction Temperature
Transient
150°C
Continuous
130°C
Lead Temperature
Soldering Reflow2
260°C
Lifetime3
Normal Mode
At −40°C
480 Hours
At 23°C
1600 Hours
At 60°C
5200 Hours
At 85°C
640 Hours
At 105°C
80 Hours
Standby Mode
At −40°C
12,648 Hours
At 25°C
60,000 Hours
At 50°C
50,000 Hours
1
Based on ANSI/ESD STM5.1-2007.
2
JEDEC Standard J-STD-020.
3
Using an activation energy of 0.7 eV, verified using high temperature
operating life (HTOL) at 125°C for 1000 hours.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Close attention to
PCB thermal design is required.
θJA is the natural convection junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure. θJC is
the junction to case thermal resistance.
Table 3. Thermal Resistance
Package Type
θJA
θJC
Unit
CP-32-151
40
15
°C/W
1
Test Condition 1: thermal impedance simulated values are based on JEDEC
4-layer test board.
ESD CAUTION




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