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ADPA7002CHIP Datasheet(Fiches technique) 5 Page - Analog Devices

Numéro de pièce ADPA7002CHIP
Description  GaAs, pHEMT, MMIC,1/2 W, Power Amplifier
Télécharger  23 Pages
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Fabricant  AD [Analog Devices]
Site Internet  http://www.analog.com
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Data Sheet
ADPA7002CHIP
Rev. 0 | Page 5 of 23
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
Mnemonic
Description
1
RFIN
Radio Frequency (RF) Signal Input. This pad is ac-coupled and matched to 50 Ω.
2 to 9, 14, 16, 19, 21
NIC
No Internal Connection. These pads have no internal connections.
10
VREF
Reference Diode for Temperature Compensation of VDET RF Output Power Measurements.
11, 22, Die Bottom
GND
Ground. These pads and the die bottom must be connected to RF and dc ground.
12
RFOUT
RF Signal Output. This pad is ac-coupled and matched to 50 Ω.
13
VDET
Detector Diode to Measure RF Output Power. Output power detection via this pin requires
the application of a dc bias voltage through an external series resistor. Used in combination
with the VREF pin, the difference voltage (VREF − VDET) is a temperature compensated dc
voltage that is proportional to the RF output power.
15, 17, 18
VDD1, VDD2A, VDD2B
Drain Biases for Amplifier. External bypass capacitors of 4.7 μF and 0.01 μF are required.
20
VGG1
Gate Control for Amplifier. External bypass capacitors of 4.7 μF and 0.01 μF are required.
GND
RFIN
NOTES
1. NIC = NO INTERNAL CONNECTION. THESE PADS HAVE NO INTERNAL CONNECTION.
RFOUT
GND
ADPA7002CHIP
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