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ADP5072 Fiches technique(PDF) 24 Page - Analog Devices |
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ADP5072 Fiches technique(HTML) 24 Page - Analog Devices |
24 / 24 page ADP5072 Data Sheet Rev. 0 | Page 24 of 24 OUTLINE DIMENSIONS A B C D E 2.220 2.180 2.140 1.650 1.610 1.570 1 2 3 4 TOP VIEW (BALL SIDE DOWN) SIDE VIEW BOTTOM VIEW (BALL SIDE UP) BALL A1 IDENTIFIER 0.40 BSC 0.560 0.500 0.440 0.330 0.300 0.270 0.230 0.200 0.170 0.225 0.205 0.185 0.310 0.290 0.270 0.300 0.260 0.220 1.60 REF 1.20 REF COPLANARITY 0.04 SEATING PLANE Figure 49. 20-Ball Wafer Level Chip Scale Package [WLCSP] (CB-20-14) Dimensions shown in millimeters ORDERING GUIDE Model1 Temperature Range Package Description Package Option ADP5072ACBZ-R7 −40°C to +125°C 20-Ball Wafer Level Chip Scale Package [WLCSP] CB-20-14 ADP5072CB-EVALZ Evaluation Board 1 Z = RoHS Compliant Part. ©2019 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D16646-0-1/19(0) |
Numéro de pièce similaire - ADP5072 |
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Description similaire - ADP5072 |
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