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GRM1552C1E6R4DA01D Datasheet(Fiches technique) 16 Page - Murata Manufacturing Co., Ltd.

Numéro de pièce GRM1552C1E6R4DA01D
Description  Chip Multilayer Ceramic Capacitors for General Purpose
Télécharger  30 Pages
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Fabricant  MURATA [Murata Manufacturing Co., Ltd.]
Site Internet  http://www.murata.com
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 16 page
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4-2.Flow Soldering
1. Do not apply flow soldering to chips not listed in Table 2.
[Standard Conditions for Flow Soldering]
Table 2
Series
GRM
2. When sudden heat is applied to the components, the mechanical strength of the components will
decrease because a sudden temperature change causes deformation inside the components.
In order to prevent mechanical damage to the components, preheating is required for both of the
components and the PCB.
Preheating conditions are shown in table 2.
It is required to keep the temperature differential between the solder and the components surface
[Allowable Flow Soldering Temperature and Time]
(ΔT) as low as possible.
3. Excessively long soldering time or high soldering temperature can result in leaching of the
terminations, causing poor adhesion or a reduction in capacitance value due to loss of contact
between the inner electrodes and terminations.
4. When components are immersed in solvent after mounting, be sure to maintain the temperature
differential (ΔT) between the component and solvent within the range shown in the table 2.
Recommended Conditions
In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Lead Free Solder: Sn-3.0Ag-0.5Cu
5. Optimum Solder Amount for Flow Soldering
5-1. The top of the solder fillet should be lower than the thickness of the components.
If the solder amount is excessive, the risk of cracking is higher during board
bending or any other stressful condition.
Soldering Peak Temperature
250 to 260℃
Atmosphere
Air or N2
Chip Dimension(L/W) Code
Temperature Differential
18/21/31
ΔT≦150℃
Lead Free Solder
Preheating Peak Temperature
100 to 120℃
Soldering Time(s)
280
270
260
250
240
230
220
0
10
20
40
30
Temperature(℃)
Soldering
Peak
Temperature
Preheating
Peak
Temperature
30 to 90 s
Preheating
5 s max.
Time
Gradual
Cooling
Soldering
ΔT
Up to Chip Thickness
Adhesive
in section
GRM1552C1E6R4DA01-01A




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