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GRM1552C1E5R6CA01D Datasheet(Fiches technique) 17 Page - Murata Manufacturing Co., Ltd.

Numéro de pièce GRM1552C1E5R6CA01D
Description  Chip Multilayer Ceramic Capacitors for General Purpose
Télécharger  30 Pages
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Fabricant  MURATA [Murata Manufacturing Co., Ltd.]
Site Internet  http://www.murata.com
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 17 page
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4-3.Correction of Soldered Portion
 When sudden heat is applied to the capacitor, distortion caused by the large temperature difference occurs internally, and can be the cause of cracks.
Capacitors also tend to be affected by mechanical and thermal stress depending on the board preheating temperature or the soldering fillet shape, and can be the cause of cracks.
Please refer to "1. PCB Design" or "3. Optimum solder amount" for the solder amount and the fillet shapes.
1. Correction with a Soldering Iron
 1-1. In order to reduce damage to the capacitor, be sure to preheat the capacitor and the mounting board.
Preheat to the temperature range shown in Table 3. A hot plate, hot air type preheater, etc. can be used for preheating.
1-2. After soldering, do not allow the component/PCB to cool down rapidly.
1-3. Perform the corrections with a soldering iron as quickly as possible. If the soldering iron is applied too long, there is a possibility of
causing solder leaching on the terminal electrodes, which will cause deterioration of the adhesive strength and other problems.
Table 3
Lead Free Solder: Sn-3.0Ag-0.5Cu
* Please manage Δ T in the temperature of soldering iron and the preheating temperature.
2. Correction with Spot Heater
 Compared to local heating with a soldering iron, hot air heating by a spot heater heats the overall component and board,
therefore, it tends to lessen the thermal shock. In the case of a high density mounted board, a spot heater can also prevent concerns
of the soldering iron making direct contact with the component.
2-1. If the distance from the hot air outlet of the spot heater to the component is too close, cracks may occur due to thermal shock.
To prevent this problem, follow the conditions shown in Table 4.
2-2. In order to create an appropriate solder fillet shape, it is recommended that hot air be applied at the angle shown in Figure 1.
Table 4
Distance
5mm or more
Hot Air Application angle
45° *Figure 1
Hot Air Temperature Nozzle Outlet 400°C max.
Less than 10 s
(3216M / 1206 size or smaller)
Less than 30 s
(3225M / 1210 size or larger)
(3216M , 3225M : Metric size code)
3. Optimum solder amount when re-working with a soldering iron
3-1. If the solder amount is excessive, the risk of cracking is higher during board bending or any other stressful condition.
Too little solder amount results in a lack of adhesive strength on the termination, which may result in chips breaking loose from the PCB.
Please confirm that solder has been applied smoothly is and rising to the end surface of the chip.
3-2. A soldering iron with a tip of ø3mm or smaller should be used.
in section
It is also necessary to keep the soldering iron from touching the components during the re-work.
3-3. Solder wire with ø0.5mm or smaller is required for soldering.
Application Time
GRM
32/43/55
280℃ max.
150℃ min.
ΔT≦130℃
Air
GRM
03/15/18/JN/21/31
350℃ max.
150℃ min.
ΔT≦190℃
Air
Series
Chip Dimension
(L/W) Code
Temperature of
Soldering Iron Tip
Preheating
Temperature
Temperature
Differential(ΔT)
Atmosphere
One-hole Nozzle
an Angle of 45
[Figure 1]
Solder Amount
GRM1552C1E5R6CA01-01A




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