Substrate Bending Test

・Test Substrate

Material : JIS C 6484 Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)

Thickness :

0.8mm

Copper Foil Thickness: 0.035mm

Kind of Solder : Sn-3.0Ag-0.5Cu

Fig.1 (in mm)

・Pressurization Method

Fig.2 (in mm)

Adhesive Strength of Termination, Vibration, Temperature Sudden Change, High Temperature High Humidity(Steady), Durability

・Test Substrate

Material : JIS C 6484 Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)

Thickness :

1.6mm or 0.8mm

Copper Foil Thickness: 0.035mm

Kind of Solder : Sn-3.0Ag-0.5Cu

・Land Dimensions

Fig.3

Step

Temperature(℃)

Time (min)

1

Min.Operating Temp. +0/-3

30+/-3

2

Reference Temp.

2 to 3

3

Max.Operating Temp. +3/-0

30+/-3

4

Reference Temp.

2 to 3

Dimension(mm)

a

b

c

0.4

1.5

0.5

Series

GRM15

Dimension(mm)

a

b

c

0.4

1.5

0.5

Series

GRM15

Step

Temperature(°C)

Applying Voltage

1

Reference Temp. +/-2

2

Min. Operating Temp. +/-3

3

*

Reference Temp. +/-2

4

Max. Operating Temp. ±3

5

Reference Temp. +/-2

No bias

45

45

Flexure

Capacitance meter

Pressurization speed

1.0mm/s

Support

Capacitor

Pressurize

45

45

R5

20

50min.

b

a

Solder Resist

Chip Capacitor

Land

*1,2：2.0±0.05

100

a

4.0±0.1

b

Land

4.5

Solder Resist (Coat with heat resistant resin for solder)

GRM1552C1E5R4BA01-01A