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GD25LH32D Fiches technique(PDF) 65 Page - GigaDevice Semiconductor (Beijing) Inc. |
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GD25LH32D Fiches technique(HTML) 65 Page - GigaDevice Semiconductor (Beijing) Inc. |
65 / 68 page 1.8V Uniform Sector Dual and Quad Serial Flash GD25LH32D 65 10.4. Package USON8 (4*4mm, thickness 0.45mm) D E Top View D1 E1 L b e Bottom View c A1 A Side View PIN 1# 1 4 8 5 Dimensions Symbol A A1 c b D D1 E E1 e L Unit mm Min 0.40 0.00 0.10 0.25 3.90 2.20 3.90 2.90 0.80 0.35 Nom 0.45 0.02 0.15 0.30 4.00 2.30 4.00 3.00 0.40 Max 0.50 0.05 0.20 0.35 4.10 2.40 4.10 3.10 0.45 Note: 1. Both the package length and width do not include the mold flash. 2. The exposed metal pad area on the bottom of the package is floating. 3. Coplanarity ≤0.08mm. Package edge tolerance≤0.10mm. 4. The lead shape may be of little difference according to different package factories. These lead shapes are compatible with each other |
Numéro de pièce similaire - GD25LH32D |
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Description similaire - GD25LH32D |
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