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ITG-3400 Datasheet(Fiches technique) 35 Page - TDK Electronics

Numéro de pièce ITG-3400
Description  Triple-axis MEMS gyroscope
Télécharger  41 Pages
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Fabricant  TDK [TDK Electronics]
Site Internet  http://www.tdk.com
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 35 page
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ITG-3400 Product Specification
Document Number: PS-ITG-3400A-00
Revision: 1.0
Release Date: 12/24/2013
35 of 41
8.4.7
ESD Considerations
Establish and use ESD-safe handling precautions when unpacking and handling ESD-sensitive devices.
Store ESD sensitive devices in ESD safe containers until ready for use, such as the original moisture
sealed bags, until ready for assembly.
Restrict all device handling to ESD protected work areas that measure less than 200V static charge.
Ensure that all workstations and personnel are properly grounded to prevent ESD.
8.4.8
Reflow Specification
Qualification Reflow: The ITG-3400 was qualified in accordance with IPC/JEDEC J-STD-020D.1. This
standard classifies proper packaging, storage and handling in order to avoid subsequent thermal and
mechanical damage during the solder reflow attachment phase of PCB assembly.
The qualification preconditioning process specifies a sequence consisting of a bake cycle, a moisture soak
cycle (in a temperature humidity oven), and three consecutive solder reflow cycles, followed by functional
device testing.
The peak solder reflow classification temperature requirement for package qualification is (260 +5/-0°C) for
lead-free soldering of components measuring less than 1.6 mm in thickness. The qualification profile and a
table explaining the set-points are shown below:
Time [Seconds]
SOLDER REFLOW PROFILE FOR QUALIFICATION
LEAD-FREE IR/CONVECTION
Preheat
60-120sec
Tsmax
Tsmin
TLiquidus
TPmin
TPmax
Liquidus
60-120sec
10-30sec
Tramp-up
( < 3 C/sec)
Tramp-down
( < 4 C/sec)
Troom-Pmax
(< 480sec)
A
B
C
D
E
F
G
H
I




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