Moteur de recherche de fiches techniques de composants électroniques
  French  ▼
ALLDATASHEET.FR

X  

GRM31C5C3A821FWA3 Fiches technique(PDF) 16 Page - Murata Manufacturing Co., Ltd.

No de pièce GRM31C5C3A821FWA3
Description  Chip Multilayer Ceramic Capacitors for General Purpose
Download  28 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Fabricant  MURATA [Murata Manufacturing Co., Ltd.]
Site Internet  http://www.murata.com
Logo MURATA - Murata Manufacturing Co., Ltd.

GRM31C5C3A821FWA3 Fiches technique(HTML) 16 Page - Murata Manufacturing Co., Ltd.

Back Button GRM31C5C3A821FWA3 Datasheet HTML 12Page - Murata Manufacturing Co., Ltd. GRM31C5C3A821FWA3 Datasheet HTML 13Page - Murata Manufacturing Co., Ltd. GRM31C5C3A821FWA3 Datasheet HTML 14Page - Murata Manufacturing Co., Ltd. GRM31C5C3A821FWA3 Datasheet HTML 15Page - Murata Manufacturing Co., Ltd. GRM31C5C3A821FWA3 Datasheet HTML 16Page - Murata Manufacturing Co., Ltd. GRM31C5C3A821FWA3 Datasheet HTML 17Page - Murata Manufacturing Co., Ltd. GRM31C5C3A821FWA3 Datasheet HTML 18Page - Murata Manufacturing Co., Ltd. GRM31C5C3A821FWA3 Datasheet HTML 19Page - Murata Manufacturing Co., Ltd. GRM31C5C3A821FWA3 Datasheet HTML 20Page - Murata Manufacturing Co., Ltd. Next Button
Zoom Inzoom in Zoom Outzoom out
 16 / 28 page
background image
4-2.Flow Soldering
1. Do not apply flow soldering to chips not listed in Table 2.
     [Standard Conditions for Flow Soldering]
Table 2
Series
GR□
2. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both of the components and the PCB.
Preheating conditions are shown in table 2. It is required to
[Allowable Flow Soldering Temperature and Time]
keep the temperature differential between the solder and
the components surface (ΔT) as low as possible.
3. Excessively long soldering time or high soldering
temperature can result in leaching of the terminations,
causing poor adhesion or a reduction in capacitance value
due to loss of contact between the inner electrodes and terminations.
4. When components are immersed in solvent after mounting,
be sure to maintain the temperature differential (ΔT)
between the component and solvent within the range
shown in the table 2.
In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Recommended Conditions
Lead Free Solder : Sn-3.0Ag-0.5Cu
5. Optimum Solder Amount for Flow Soldering
5-1. The top of the solder fillet should be lower than the
thickness of the components. If the solder amount is
excessive, the risk of cracking is higher during
board bending or any other stressful condition.
Preheating Peak Temperature
100 to 120℃
Soldering Peak Temperature
250 to 260℃
Atmosphere
Air or N2
Caution
Chip Dimension(L/W) Code
Temperature Differential
18/21/31
ΔT≦150℃
Lead Free Solder
!
Soldering Time(s)
280
270
260
250
240
230
220
0
10
20
40
30
Temperature(℃)
Soldering
Peak
Temperature
Preheating
Peak
Temperature
30-90 seconds
Preheating
5 seconds max.
Time
Gradual
Cooling
Soldering
ΔT
Up to Chip Thickness
Adhesive
in section
JEMCGC-05049F
16


Numéro de pièce similaire - GRM31C5C3A821FWA3

FabricantNo de pièceFiches techniqueDescription
logo
Murata Manufacturing Co...
GRM31C5C3A821GWA3 MURATA-GRM31C5C3A821GWA3 Datasheet
1Mb / 28P
   Chip Multilayer Ceramic Capacitors for General Purpose
GRM31C5C3A821JWA3 MURATA-GRM31C5C3A821JWA3 Datasheet
1Mb / 28P
   Chip Multilayer Ceramic Capacitors for General Purpose
More results

Description similaire - GRM31C5C3A821FWA3

FabricantNo de pièceFiches techniqueDescription
logo
Murata Manufacturing Co...
GRM0335C1H7R1DA01 MURATA-GRM0335C1H7R1DA01 Datasheet
788Kb / 30P
   Chip Multilayer Ceramic Capacitors for General Purpose
GRM0335C2AR60BA01 MURATA-GRM0335C2AR60BA01 Datasheet
788Kb / 30P
   Chip Multilayer Ceramic Capacitors for General Purpose
GRM1857U1H332JA44 MURATA-GRM1857U1H332JA44 Datasheet
782Kb / 30P
   Chip Multilayer Ceramic Capacitors for General Purpose
GRM1882C1H102JA01 MURATA-GRM1882C1H102JA01 Datasheet
782Kb / 30P
   Chip Multilayer Ceramic Capacitors for General Purpose
GRM21A5C2J330JWA1 MURATA-GRM21A5C2J330JWA1 Datasheet
1Mb / 28P
   Chip Multilayer Ceramic Capacitors for General Purpose
GRM21A5C2E181JW01 MURATA-GRM21A5C2E181JW01 Datasheet
1Mb / 28P
   Chip Multilayer Ceramic Capacitors for General Purpose
GRM21A5C2J470JWA1 MURATA-GRM21A5C2J470JWA1 Datasheet
1Mb / 28P
   Chip Multilayer Ceramic Capacitors for General Purpose
GRM21A7U2D182JW31 MURATA-GRM21A7U2D182JW31 Datasheet
1Mb / 28P
   Chip Multilayer Ceramic Capacitors for General Purpose
GRM21B5C2E392JWA1 MURATA-GRM21B5C2E392JWA1 Datasheet
1Mb / 28P
   Chip Multilayer Ceramic Capacitors for General Purpose
GRM21B5C2E562JWAA MURATA-GRM21B5C2E562JWAA Datasheet
1Mb / 28P
   Chip Multilayer Ceramic Capacitors for General Purpose
GRM21B5C2J182JWAA MURATA-GRM21B5C2J182JWAA Datasheet
1Mb / 28P
   Chip Multilayer Ceramic Capacitors for General Purpose
More results


Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28


Fiches technique Télécharger

Go To PDF Page


Lien URL




Politique de confidentialité
ALLDATASHEET.FR
ALLDATASHEET vous a-t-il été utile ?  [ DONATE ] 

À propos de Alldatasheet   |   Publicité   |   Contactez-nous   |   Politique de confidentialité   |   Echange de liens   |   Fabricants
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com