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ISD5116EY Datasheet(Fiches technique) 54 Page - Nuvoton Technology Corporation

Numéro de pièce ISD5116EY
Description  SINGLE-CHIP
Télécharger  90 Pages
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Fabricant  NUVOTON [Nuvoton Technology Corporation]
Site Internet  http://www.nuvoton.com
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 54 page
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ISD5100 SERIES
Publication Release Date: Oct 31, 2008
- 54 -
Revision 1.42
6.6.3
Power and Ground Pins
VCCA, VCCD (Voltage Inputs)
To minimize noise, the analog and digital circuits in the ISD5100 Series devices use separate power
busses. These +3 V busses lead to separate pins. Tie the VCCD pins together as close as possible and
decouple both supplies as near to the package as possible.
VSSA, VSSD (Ground Inputs)
The ISD5100 Series utilizes separate analog and digital ground busses. The analog ground (VSSA)
pins should be tied together as close to the package as possible and connected through a low-
impedance path to power supply ground. The digital ground (VSSD) pin should be connected through a
separate low impedance path to power supply ground. These ground paths should be large enough to
ensure that the impedance between the VSSA pins and the VSSD pin is less than 3Ω. The backside of
the die is connected to VSSD through the substrate resistance. In a chip-on-board design, the die
attach area must be connected to VSSD.
NC (Not Connect)
These pins should not be connected to the board at any time. Connection of these pins to any signal,
ground or VCC, may result in incorrect device behavior or cause damage to the device.




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