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UC2854BQ Fiches technique(PDF) 3 Page - Texas Instruments

No de pièce UC2854BQ
Description  ADVANCED HIGH-POWER FACTOR PREREGULATOR
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Fabricant  TI [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI - Texas Instruments

UC2854BQ Fiches technique(HTML) 3 Page - Texas Instruments

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UC1854B
UC2854A, UC2854B
UC3854A, UC3854B
SLUS329B − JUNE 1998 − REVISED FEBRUARY 2005
3
www.ti.com
PACKAGE DESCRIPTION
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
GND
PKLMT
CAO
ISENSE
MOUT
IAC
VAO
VRMS
GTDRV
VCC
CT
SS
RSET
VSENSE
ENA
VREF
J, N and DW PACKAGES
(TOP VIEW)
5
4
6
7
8
18
17
16
15
14
ISENSE
CAOUT
N/C
MOUT
IAC
CT
SS
N/C
RSET
VSENSE
3
2 1 20 19
9 10 11 12 13
Q PACKAGE
(TOP VIEW)
N/C − No connection
ORDERING INFORMATION
UVLO
UVLO
PART NUMBERS
TA
UVLO
TURN-ON
(V)
UVLO
TURN-OFF
(V)
CDIP−16
(J)
PDIP−16
(N)
SOIC−16
(DW)
PLCC−20
(Q)
−55
°C to 125°C
16
10
−55
°C to 125°C
10.5
10
UC1854BJ
−40
°C to 85°C
16
10
UC2854AJ
UC2854AN
UC2854ADW
UC2854AQ
−40
°C to 85°C
10.5
10
UC2854BJ
UC2854BN
UC2854BDW
UC2854BQ
0
°C to 70°C
16
10
UC3854AN
UC3854ADW
0
°C to 70°C
10.5
10
UC3854BN
UC3854BDW
(1) The DW and Q packages are available taped and reeled. Add TR suffix to device type (e.g. UC2854ADWTR) to order quantities of 2,000
devices per reel for the DW package and 1,000 devices per reel for the Q package.
THERMAL RESISTANCE
PACKAGED DEVICES
RESISTANCES
CDIP−16
(J)
PDIP−16
(N)
SOP−16
(DW)
PLCC−20
(Q)
θJC (°C/W)
28(2)
45
27
34
θJA (°C/W)
80−120
90(3)
50−130(3)
43−75(3)
(2) θJC data values stated are derived from MIL-STD-1835B which states “the baseline values shown are worst case (mean +2s) for a 60 × 60
mil microcircuit device silicon die and applicable for devices with die sizes up to 14,400 square mils. For device die sizes greater than
14,400 square mils use the following values, dual-in-line, 11
°C/W; flat pack and pin grid array, 10°C/W.
(3) θJA (junction-to-ambient) applies to devices mounted to five square inch FR4 PC board with one ounce copper where noted. When
resitance range is given, lower values are for five square inch aluminum PC board. Test PWB is 0.062 inches thick and typically uses
0.635 mm trace widths for power packages and 1.3 mm trace widths for non-power packages with a 100
× 100 mil probe land are at the
end of each trace.


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