MAX8632 datasheet(2/29 Pages) MAXIM

No de pièce	MAX8632

Description	Integrated DDR Power-Supply Solution for Desktops,Notebooks, and Graphic Cards

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Fabricant	MAXIM [Maxim Integrated Products]

Site Internet	https://www.maximintegrated.com/en.html

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PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

MAIN PWM CONTROLLER

VIN

228

Input Voltage Range

VDD, AVDD

4.5

5.5

V

Output Adjust Range

VOUT

0.7

5.5

V

FB = OUT

0.693

0.7

0.707

FB = GND

2.47

2.5

2.53

Output Voltage Accuracy

(Note 2)

FB = VDD

1.78

1.8

1.82

V

Soft-Start Ramp Time

tSS

Rising edge of SHDN to full current limit

1.7

ms

TON = GND (600kHz)

170

194

219

TON = REF (450kHz)

213

243

273

TON = open (300kHz)

316

352

389

On-Time

tON

VIN = 15V,

VOUT = 1.5V

(Note 3)

TON = AVDD (200kHz)

461

516

571

ns

Minimum Off-Time

tOFF_MIN

(Note 3)

200

300

450

ns

VIN Quiescent Supply Current

IIN

25

40

µA

VIN Shutdown Supply Current

SHDN = GND

1

5

µA

All on (PWM, VTT, and VTTR on)

2.5

5

AVDD Quiescent Supply Current

IAVDD

STBY = GND (only VTTR and PWM on)

1

2

mA

AVDD + VDD Shutdown Supply

Current

SHDN = GND

20

µA

Rising edge of VIN

4.05

4.25

4.40

V

AVDD Undervoltage-Lockout

Threshold

Hysteresis

50

mV

VDD Quiescent Supply Current

IVDD

Set VFB = 0.8V

1

5

µA

Integrated DDR Power-Supply Solution for

Desktops, Notebooks, and Graphic Cards

2

_______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(VIN = +15V, VDD = AVDD = V SHDN = STBY = VBST = VILIM = 5V, VOUT = VREFIN = VVTTI = 2.5V, UVP/OVP = TP0 = FB = SKIP

= GND, PGND1 = PGND2 = LX = GND, TON = OPEN, VVTTS = VVTT, TA = -40°C to +85°C, unless otherwise noted. Typical values

are at TA = +25°C.) (Note 1)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

VIN to GND .............................................................-0.3V to +30V

VDD, AVDD , VTTI to GND .........................................-0.3V to +6V

SHDN, REFIN to GND ..............................................-0.3V to +6V

SS, POK1, POK2, SKIP, ILIM, FB to GND ................-0.3V to +6V

STBY, TON, REF, UVP/OVP to GND ........-0.3V to (AVDD + 0.3V)

OUT, VTTR to GND ..................................-0.3V to (AVDD + 0.3V)

DL to PGND1..............................................-0.3V to (VDD + 0.3V)

DH to LX ....................................................-0.3V to (VBST + 0.3V)

LX to BST..................................................................-6V to +0.3V

LX to GND .................................................................-2V to +30V

VTT to GND...............................................-0.3V to (VVTTI + 0.3V)

VTTS to GND............................................-0.3V to (AVDD + 0.3V)

PGND1, PGND2, TP0 to GND ...............................-0.3V to +0.3V

REF Short Circuit to GND ...........................................Continuous

Continuous Power Dissipation (TA = +70°C)

28-Pin 5mm x 5mm Thin QFN (derate 35.7mW/°C

above +70°C).................................................................2.86W

Operating Temperature Range ...........................-40°C to +85°C

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

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