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74HC283N Datasheet(Fiches technique) 2 Page - NXP Semiconductors

Numéro de pièce 74HC283N
Description  4-bit binary full adder with fast carry
Télécharger  20 Pages
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Fabricant  PHILIPS [NXP Semiconductors]
Site Internet  http://www.nxp.com
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9397 750 13811
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 03 — 11 November 2004
2 of 20
Philips Semiconductors
74HC283
4-bit binary full adder with fast carry
3.
Quick reference data
[1]
CPD is used to determine the dynamic power dissipation (PD in µW).
PD =CPD × VCC2 × fi × N+ ∑(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
∑(C
L × VCC
2
× f
o) = sum of outputs.
4.
Ordering information
Table 1:
Quick reference data
GND = 0 V; Tamb =25 °C; tr =tf = 6 ns.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tPHL, tPLH
propagation delay
CL = 15 pF; VCC =5 V
CIN to S1
-
16
-
ns
CIN to S2
-
18
-
ns
CIN to S3
-
20
-
ns
CIN to S4
-
23
-
ns
An or Bn to Sn
-
21
-
ns
CIN to COUT
-
20
-
ns
An or Bn to COUT
-
20
-
ns
CI
input capacitance
-
3.5
-
pF
CPD
power dissipation
capacitance
VI = GND to VCC
[1] -88
-
pF
Table 2:
Ordering information
Type number
Package
Temperature range
Name
Description
Version
74HC283N
−40 °C to +125 °C
DIP16
plastic dual in-line package; 16 leads (300 mil)
SOT38-4
74HC283D
−40 °C to +125 °C
SO16
plastic small outline package; 16 leads;
body width 3.9 mm
SOT109-1
74HC283DB
−40 °C to +125 °C
SSOP16
plastic shrink small outline package; 16 leads;
body width 5.3 mm
SOT338-1
74HC283PW
−40 °C to +125 °C
TSSOP16
plastic thin shrink small outline package;
16 leads; body width 4.4 mm
SOT403-1




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