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STK672-210 Fiches technique(PDF) 6 Page - Sanyo Semicon Device |
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STK672-210 Fiches technique(HTML) 6 Page - Sanyo Semicon Device |
6 / 8 page No.7464-6/8 STK672-210 Thermal Design The size of the heat sink required for the STK672-210 depends on the motor output current IOH (A), the electrical characteristics of the motor, the excitation mode, and the basic drive frequency. The thermal resistance ( θc-a) of the required heat sink can be determined from the following formula. Tc max – Ta θc – a = —————— (°C/W) Pd Tcmax: The STK672-210 substrate temperature (°C) Ta: The STK672-210 ambient temperature (°C) Pd: The average internal power dissipation in the STK672-210 (W) For example, the required area for a heat sink made from 2 mm thick aluminum can be determined from the graph at the right below. Note that the ambient temperature is greatly influenced by the ventilation and air flow patterns within the application. This means that the size of the heat sink must be determined with care so that the STK672-210 back surface (aluminum substrate) temperature Tc in the mounted state never exceeds, under any conditions that might occur, the temperature Tc = 105 °C. STK672-210 Average Internal Power Dissipation Pd Of the devices that contribute to the STK672-210 average internal power supply, the devices with the largest power dissipation are the current control devices, the diodes that handle the regenerative current, the current detection resistor, and the predriver circuit. The following presents formulas for calculating the power dissipation for the different excitation (drive) modes. 2 phase excitation mode Pd2EX = (Vsat + Vdf) × 0.5 × Clock × IOH × t2 + 0.5 × Clock × IOH × (Vsat × t1 + Vdf × t3) 1-2 phase excitation mode Pd1-2EX = (Vsat + Vdf) × 0.25 × Clock × IOH × t2 + 0.25 × Clock × IOH × (Vsat × t1 + Vdf × t3) Motor hold mode PdHOLDEX = (Vsat + Vdf) × IOH Vsat: Ron voltage drop + shunt resistor combined voltage Vdf: FET internal diode Vdf + shunt resistor combined voltage Clock: Input clock CLK (the reference frequency prior to splitting into 4 phases) ITF01880 0 4 8 12 16 20 2 6 10 14 18 IC internal average power dissipation, Pd — W θc-a — Pd 0 8 12 16 20 4 ITF01881 10 2 3 5 7 100 1000 2 3 5 7 Heat sink area, S — cm2 θc-a — S 1.0 5 7 2 3 10 100 5 7 2 3 No Fin 23.0[ °C / W] Tc max=105 °C 40 °C 50 °C 60 °C No Fin 23.0[ °C / W] Mounted vertically Convection cooling θc-a= ( °C / W) Tc max--Ta Pd Guaranteed ambient temperature 2 mm thick Al plate (with no surface finish) (With a flat black surface finish) ITF02290 IOH 0A t3 t2 t1 Figure 1 Motor Output Current Waveform Model (Commutation Current) |
Numéro de pièce similaire - STK672-210 |
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Description similaire - STK672-210 |
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